公开(公告)号：US20250078249A1

公开(公告)日：2025-03-06

申请号：US18753198

申请日：2024-06-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minwoo JEON ,  Kanggyune LEE ,  Hyunho CHU

IPC: G06T7/00 ,  G01N21/95 ,  G06T7/13 ,  G06T7/136 ,  G06T7/64

Abstract: A method of inspecting a mark of a semiconductor package includes: acquiring an original inspection image and an original reference image to determine whether the mark is defective; acquiring a target reference image and a target inspection image by converting each of the original reference image and the original inspection image into a binary image through thresholding; calculating an area matching rate by calculating a number of error pixels that have different brightness values from each other, among pixels of the target reference image that correspond to pixels of the target inspection image, and by using the number of error pixels relative to a number of total pixels of the target reference image; and calculating a shape matching rate by acquiring a first circularity of the target reference image and a second circularity of the target inspection image, and by comparing the first circularity with the second circularity.

公开(公告)号：US20240105636A1

公开(公告)日：2024-03-28

申请号：US18336313

申请日：2023-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kanggyune LEE ,  Sangwon LEE ,  Woojin CHOI

IPC: H01L23/544 ,  H01L23/31 ,  H01L23/36 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/16 ,  H01L25/0657 ,  H01L2223/54433 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562

Abstract: A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a first marking pattern in or on the first inclined surface of the sealing layer.

公开(公告)号：US20250096148A1

公开(公告)日：2025-03-20

申请号：US18762757

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kanggyune LEE ,  Sangwon LEE ,  Hyeon HWANG

IPC: H01L23/544 ,  H01L23/00 ,  H01L23/31

Abstract: A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of the dry film by radiating laser light to the carrier substrate, forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film, and removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied, wherein the ink marking pattern includes information about storage capacity or information for identifying a producer of a product.