公开(公告)号：US20250078249A1

公开(公告)日：2025-03-06

申请号：US18753198

申请日：2024-06-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minwoo JEON ,  Kanggyune LEE ,  Hyunho CHU

IPC: G06T7/00 ,  G01N21/95 ,  G06T7/13 ,  G06T7/136 ,  G06T7/64

Abstract: A method of inspecting a mark of a semiconductor package includes: acquiring an original inspection image and an original reference image to determine whether the mark is defective; acquiring a target reference image and a target inspection image by converting each of the original reference image and the original inspection image into a binary image through thresholding; calculating an area matching rate by calculating a number of error pixels that have different brightness values from each other, among pixels of the target reference image that correspond to pixels of the target inspection image, and by using the number of error pixels relative to a number of total pixels of the target reference image; and calculating a shape matching rate by acquiring a first circularity of the target reference image and a second circularity of the target inspection image, and by comparing the first circularity with the second circularity.