公开(公告)号：US20240105636A1

公开(公告)日：2024-03-28

申请号：US18336313

申请日：2023-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kanggyune LEE ,  Sangwon LEE ,  Woojin CHOI

IPC: H01L23/544 ,  H01L23/31 ,  H01L23/36 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/544 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/16 ,  H01L25/0657 ,  H01L2223/54433 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562

Abstract: A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a first marking pattern in or on the first inclined surface of the sealing layer.

公开(公告)号：US20230261615A1

公开(公告)日：2023-08-17

申请号：US18304050

申请日：2023-04-20

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Seunghoon JEE ,  Youngoo YANG ,  Yifei CHEN ,  Hyunuk KANG ,  Kyoungtae KIM ,  Youngyoon WOO ,  Jaekyung SHIN ,  Woojin CHOI

IPC: H03F1/02 ,  H03F3/24 ,  H03F3/60 ,  H03F1/56

CPC classification number: H03F1/0288 ,  H03F3/24 ,  H03F3/602 ,  H03F1/565 ,  H03F2200/451 ,  H03F2200/198 ,  H03F2200/423

Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long-Term Evolution (LTE). A Doherty power amplifier of a wireless communication system is provided. The Doherty power amplifier includes a first power amplifier, a second power amplifier, a first transmission line, a 4-port coupler, and a load impedance, and the 4-port coupler includes a first port, a second port, a third port, and a fourth port, the first power amplifier is coupled with the 4-port coupler through the first port, the second power amplifier is coupled with the 4-port coupler through the fourth port, the load impedance is coupled with the 4-port coupler through the third port, the first transmission line is disposed between the first power amplifier and the first port of the 4-port coupler, and the second port is an output end of the power amplifier.

公开(公告)号：US20230198480A1

公开(公告)日：2023-06-22

申请号：US18168223

申请日：2023-02-13

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Seunghoon JEE ,  Youngoo YANG ,  Yifei CHEN ,  Hyunuk KANG ,  Kyoungtae KIM ,  Changwook KIM ,  Youngyoon WOO ,  Woojin CHOI

IPC: H03F3/21 ,  H03F1/02 ,  H03F1/56

CPC classification number: H03F3/211 ,  H03F1/0288 ,  H03F1/565 ,  H03F2200/387 ,  H03F2200/451

Abstract: The disclosure relates to a 5th generation (5G) or a pre-5G communication system for supporting a higher data transmission rate after a 4th generation (4G) communication system such as long-term evolution (LTE). A Doherty power amplifier of a wireless communication system is provided. The Doherty power amplifier includes a first power amplifier, a second power amplifier, a first transmission line connected to an output end of the first power amplifier, a second transmission line connected to an input end of the second power amplifier, a first network, and a second network, the first network may interconnect a first node connected with one end of the first transmission line and a second node connected with an output end of the second power amplifier, the one end of the first transmission line may be positioned on an opposite side with respect to the output end of the first power amplifier, and the second network may connect the first node, the second node, and a third node which is an output end of the Doherty power amplifier.

公开(公告)号：US20230100675A1

公开(公告)日：2023-03-30

申请号：US17989316

申请日：2022-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US20250138585A1

公开(公告)日：2025-05-01

申请号：US19004944

申请日：2024-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An example electronic device may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US20220285825A1

公开(公告)日：2022-09-08

申请号：US17679284

申请日：2022-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokwoo LEE ,  Yeonghun GU ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02 ,  H04M1/72454

Abstract: An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.