公开(公告)号：US20230100675A1

公开(公告)日：2023-03-30

申请号：US17989316

申请日：2022-11-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An electronic device according to various embodiments of the disclosure may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US20250138585A1

公开(公告)日：2025-05-01

申请号：US19004944

申请日：2024-12-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonghun GU ,  Keunpyo PARK ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: G06F1/16 ,  H05K7/14

Abstract: An example electronic device may include a first housing on which a first printed circuit board including a processor is disposed, a second housing on which a second printed circuit board including a display driver for a display is disposed, a hinge structure configured to physically connect the first housing and the second housing such that the first housing and the second housing are foldable/unfoldable, and a cable structure configured to electrically connect the first printed circuit board and the second printed circuit board via the hinge structure. The cable structure may include a first cable configured to transfer display signals and a second cable branched off from the first cable to be grounded to the hinge structure.

公开(公告)号：US20250106541A1

公开(公告)日：2025-03-27

申请号：US18974602

申请日：2024-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ko CHOI ,  Yeonghun GU ,  Youngho PARK ,  Seokwoo LEE ,  Kio JUNG ,  Jiwoo LEE ,  Jeongseob KIM

IPC: H04R1/02 ,  H04R1/32

Abstract: An electronic device including a noise reduction member is disclosed with a speaker and an antenna. The speaker includes a speaker core for generating sound in a first direction; a speaker housing at least partially enclosing the exterior of the speaker core and including a speaker hole positioned to overlap with the speaker core with respect to the first direction; and a noise reduction member including a conductive material and positioned on the outer surface of the speaker housing. The noise reduction member includes a shielding member having an opening on a surface facing perpendicularly to the first direction, the region at least partially overlapping the speaker core. The shielding member includes the conductive material surrounding the outer perimeter of the speaker hole on the outer surface of the speaker housing; and a conductive extension part formed by extension of the conductive material from the shielding member.

公开(公告)号：US20220285825A1

公开(公告)日：2022-09-08

申请号：US17679284

申请日：2022-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokwoo LEE ,  Yeonghun GU ,  Youngho PARK ,  Jiwoo LEE ,  Kio JUNG ,  Ko CHOI ,  Woojin CHOI

IPC: H01Q1/24 ,  H01Q1/38 ,  H04M1/02 ,  H04M1/72454

Abstract: An electronic device is disclosed, including: a housing including a nonconductive area, a first printed circuit board (PCB) including a cavity and a fill-cut area, overlapping the nonconductive area, a first antenna module including at least one antenna array disposed in the cavity of the first PCB, a support frame coupled to one surface of the first PCB, supporting the first antenna module, a grip sensing pad surrounding the cavity and overlapping the fill-cut area, and a sensing circuit unit electrically connected to the grip sensing pad, configured to control an output power of the first antenna module based on inputs received via the grip sensing pad.