公开(公告)号：US10048137B2

公开(公告)日：2018-08-14

申请号：US14506956

申请日：2014-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyongtaek Lee ,  Sangwoo Pae ,  Junekyun Park

IPC: G01K7/00 ,  G01K7/01 ,  H01L29/78 ,  B82Y40/00 ,  H01L29/775 ,  H01L29/06 ,  H01L27/088 ,  H01L23/34

Abstract: A semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement. The electrode is connected to the plurality of conductive lines. An electronic device includes a semiconductor device and has a temperature sensing function. The semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement.