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公开(公告)号：US11595633B2
公开(公告)日：2023-02-28
申请号：US17207821
申请日：2021-03-22
发明人： Song Yi Lee , Young Mi Shin , Jin Soo Ha , Jang Woon Kim , Hyun Keun Son , Joo Hyung Lee
IPC分类号： H04N13/261 , H04N13/349 , H04N7/14
摘要： An embodiment of the disclosure discloses an electronic device including at least one camera module to capture an image based on a specified angle of view, a display to display the image, a processor electrically connected with the camera module and the display. The processor detects a plurality of objects in the image, and performs setting of image data associated with at least one object of the plurality of objects such that a region, which corresponds to the at least one object, in a screen region of the display has a specified light transmittance value. Moreover, various embodiment found through the disclosure are possible.
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公开(公告)号：US11710715B2
公开(公告)日：2023-07-25
申请号：US17208005
申请日：2021-03-22
发明人： Joo Hyung Lee , Ki Tae Park , Byung Lyul Park , Joon Seok Oh , Jong Ho Yun
IPC分类号： H01L25/10 , H01L23/00 , H01L25/18 , H01L23/498 , H01L23/31
CPC分类号： H01L24/24 , H01L24/05 , H01L24/25 , H01L25/105 , H01L25/18 , H01L23/3107 , H01L23/49822 , H01L24/13 , H01L2224/0401 , H01L2224/13024 , H01L2224/2405 , H01L2224/2413 , H01L2224/24155 , H01L2224/2505 , H01L2224/25171 , H01L2224/25174 , H01L2224/82101 , H01L2224/82106 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058
摘要： A semiconductor package includes an insulating layer including a first face and a second face opposite each other, a redistribution pattern including a wiring region and a via region in the insulating layer, the wiring region being on the via region, and a first semiconductor chip connected to the redistribution pattern. The first semiconductor chip may be on the redistribution pattern. An upper face of the wiring region may be coplanar with the first face of the insulating layer.
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3.发明申请公开(公告)号：US20200294869A1
公开(公告)日：2020-09-17
申请号：US16685387
申请日：2019-11-15
发明人： Chan Hee JEONG , Hyun Ki Seo , Joo Hyung Lee , Jae Gil Lim
IPC分类号： H01L21/66 , H01L23/31 , H01L25/065 , H01L21/56
摘要： A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.
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公开(公告)号：US10075653B2
公开(公告)日：2018-09-11
申请号：US14835057
申请日：2015-08-25
发明人： Jin Hong Jeong , Joo Hyung Lee , Soo Hyung Kim
CPC分类号： H04N5/2621 , G06F1/163 , G06F2203/04806 , H04M2250/52 , H04N5/23293 , H04N5/2624 , H04N5/2628
摘要： A method and an electronic device are provided for image processing. The electronic device displays a composition selection guide having at least one composition item corresponding to at least one object in an image, on at least one display connected to the electronic device. An input is received relating to a selection of a composition item from the at least one composition item of the composition selection guide. At least one composition image corresponding to the composition item is acquired. The at least one composition image is displayed on the at least one display.
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公开(公告)号：US11031307B2
公开(公告)日：2021-06-08
申请号：US16685387
申请日：2019-11-15
发明人： Chan Hee Jeong , Hyun Ki Seo , Joo Hyung Lee , Jae Gil Lim
IPC分类号： H01L21/66 , H01L23/31 , H01L21/56 , H01L25/065
摘要： A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.
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公开(公告)号：US10958894B2
公开(公告)日：2021-03-23
申请号：US16462261
申请日：2017-11-17
发明人： Song Yi Lee , Young Mi Shin , Jin Soo Ha , Jang Woon Kim , Hyun Keun Son , Joo Hyung Lee
IPC分类号： H04N13/261 , H04N13/349 , H04N7/14
摘要： An embodiment of the disclosure discloses an electronic device including at least one camera module to capture an image based on a specified angle of view, a display to display the image, a processor electrically connected with the camera module and the display. The processor detects a plurality of objects in the image, and performs setting of image data associated with at least one object of the plurality of objects such that a region, which corresponds to the at least one object, in a screen region of the display has a specified light transmittance value. Moreover, various embodiment found through the disclosure are possible.
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