公开(公告)号：US20200294869A1

公开(公告)日：2020-09-17

申请号：US16685387

申请日：2019-11-15

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Chan Hee JEONG ,  Hyun Ki Seo ,  Joo Hyung Lee ,  Jae Gil Lim

IPC分类号： H01L21/66 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

摘要： A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.

公开(公告)号：US11031307B2

公开(公告)日：2021-06-08

申请号：US16685387

申请日：2019-11-15

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Chan Hee Jeong ,  Hyun Ki Seo ,  Joo Hyung Lee ,  Jae Gil Lim

IPC分类号： H01L21/66 ,  H01L23/31 ,  H01L21/56 ,  H01L25/065

摘要： A semiconductor package includes a buffer wafer including: a first surface; and a second surface opposite to the first surface, a stacked structure including a plurality of chips being stacked on the first surface of the buffer wafer; a first detection line formed around a periphery of the stacked structure on the first surface of the buffer wafer; and a mold layer covering the stacked structure, the first detection line and the first surface of the buffer wafer.