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公开(公告)号:US12298716B2
公开(公告)日:2025-05-13
申请号:US18222309
申请日:2023-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Korea University Research and Business Foundation, Sejong Campus
Inventor: Hoon Song , Hwi Kim , Jongha Park , Hojung Kim , Yongkyu Kim
Abstract: A method for processing a three-dimensional holographic image includes obtaining depth images from depth data of a three-dimensional object, dividing each of the depth images into a predetermined number of sub-images, obtaining interference patterns of computer-generated hologram (CGH) patches corresponding to each of the sub-images by performing a Fourier transform to calculate an interference pattern in a CGH plane for object data included in each of the sub-images, and generating a CGH for the three-dimensional object using the obtained interference patterns of the CGH patches.
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公开(公告)号:US20200301361A1
公开(公告)日:2020-09-24
申请号:US16780402
申请日:2020-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Korea University Research and Business Foundation, Sejong Campus
Inventor: Hoon Song , Hwi Kim , Jongha Park , Hojung Kim , Yongkyu Kim
Abstract: A method for processing a three-dimensional holographic image includes obtaining depth images from depth data of a three-dimensional object, dividing each of the depth images into a predetermined number of sub-images, obtaining interference patterns of computer-generated hologram (CGH) patches corresponding to each of the sub-images by performing a Fourier transform to calculate an interference pattern in a CGH plane for object data included in each of the sub-images, and generating a CGH for the three-dimensional object using the obtained interference patterns of the CGH patches.
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公开(公告)号:US20200381432A1
公开(公告)日:2020-12-03
申请号:US16718799
申请日:2019-12-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyun Lee , Jonghan Lee , Seonghwa Park , Jongha Park , Jaehoon Woo , Dabok Jeong
IPC: H01L27/092 , H01L29/06 , H01L29/78 , H01L29/66 , H01L21/8238
Abstract: An integrated circuit semiconductor device includes a first region including a first transistor and a second region in contact with the first region in a second direction. The first transistor includes a first active fin extending in a first direction, a first gate dielectric layer extending from the first active fin onto a first isolation layer in the second direction, and a first gate electrode on the first gate dielectric layer. The second region includes a second transistor including a second active fin extending in the first direction, a second gate dielectric layer extending from the second active fin onto a second isolation layer in the second direction, and a second gate electrode on the second gate dielectric layer. The integrated circuit semiconductor device includes a gate dielectric layer removal region proximate a boundary between the first region and the second region.
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公开(公告)号:US11747767B2
公开(公告)日:2023-09-05
申请号:US16780402
申请日:2020-02-03
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Korea University Research and Business Foundation, Sejong Campus
Inventor: Hoon Song , Hwi Kim , Jongha Park , Hojung Kim , Yongkyu Kim
CPC classification number: G03H1/0891 , G03H2001/0088 , G03H2001/0825 , G03H2210/30
Abstract: A method for processing a three-dimensional holographic image includes obtaining depth images from depth data of a three-dimensional object, dividing each of the depth images into a predetermined number of sub-images, obtaining interference patterns of computer-generated hologram (CGH) patches corresponding to each of the sub-images by performing a Fourier transform to calculate an interference pattern in a CGH plane for object data included in each of the sub-images, and generating a CGH for the three-dimensional object using the obtained interference patterns of the CGH patches.
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公开(公告)号:US20210272957A1
公开(公告)日:2021-09-02
申请号:US17321760
申请日:2021-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyun Lee , Jonghan Lee , Seonghwa Park , Jongha Park , Jaehoon Woo , Dabok Jeong
IPC: H01L27/092 , H01L29/06 , H01L21/8238 , H01L29/66 , H01L29/78
Abstract: An integrated circuit semiconductor device includes a first region including a first transistor and a second region in contact with the first region in a second direction. The first transistor includes a first active fin extending in a first direction, a first gate dielectric layer extending from the first active fin onto a first isolation layer in the second direction, and a first gate electrode on the first gate dielectric layer. The second region includes a second transistor including a second active fin extending in the first direction, a second gate dielectric layer extending from the second active fin onto a second isolation layer in the second direction, and a second gate electrode on the second gate dielectric layer. The integrated circuit semiconductor device includes a gate dielectric layer removal region proximate a boundary between the first region and the second region.
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公开(公告)号:US11043495B2
公开(公告)日:2021-06-22
申请号:US16718799
申请日:2019-12-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyun Lee , Jonghan Lee , Seonghwa Park , Jongha Park , Jaehoon Woo , Dabok Jeong
IPC: H01L27/092 , H01L29/06 , H01L21/8238 , H01L29/66 , H01L29/78
Abstract: An integrated circuit semiconductor device includes a first region including a first transistor and a second region in contact with the first region in a second direction. The first transistor includes a first active fin extending in a first direction, a first gate dielectric layer extending from the first active fin onto a first isolation layer in the second direction, and a first gate electrode on the first gate dielectric layer. The second region includes a second transistor including a second active fin extending in the first direction, a second gate dielectric layer extending from the second active fin onto a second isolation layer in the second direction, and a second gate electrode on the second gate dielectric layer. The integrated circuit semiconductor device includes a gate dielectric layer removal region proximate a boundary between the first region and the second region.
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公开(公告)号:US11664379B2
公开(公告)日:2023-05-30
申请号:US17321760
申请日:2021-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jaehyun Lee , Jonghan Lee , Seonghwa Park , Jongha Park , Jaehoon Woo , Dabok Jeong
IPC: H01L27/092 , H01L29/06 , H01L21/8238 , H01L29/66 , H01L29/78
CPC classification number: H01L27/0924 , H01L21/823807 , H01L21/823821 , H01L21/823878 , H01L29/0649 , H01L29/0673 , H01L29/66795 , H01L29/785
Abstract: An integrated circuit semiconductor device includes a first region including a first transistor and a second region in contact with the first region in a second direction. The first transistor includes a first active fin extending in a first direction, a first gate dielectric layer extending from the first active fin onto a first isolation layer in the second direction, and a first gate electrode on the first gate dielectric layer. The second region includes a second transistor including a second active fin extending in the first direction, a second gate dielectric layer extending from the second active fin onto a second isolation layer in the second direction, and a second gate electrode on the second gate dielectric layer. The integrated circuit semiconductor device includes a gate dielectric layer removal region proximate a boundary between the first region and the second region.
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