SYSTEM AND METHOD OF PROVIDING SENSING DATA TO ELECTRONIC DEVICE

    公开(公告)号:US20180220279A1

    公开(公告)日:2018-08-02

    申请号:US15885136

    申请日:2018-01-31

    Abstract: A server for and a method of providing sensing data to at least one electronic device is provided. The server includes a communication interface, a memory, and at least one processor, wherein the at least one processor executes the at least one instruction to receive, from a first electronic device, a first template including information about a type of sensing data required by the first electronic device and a format of the sensing data, receive a request for the sensing data from the first electronic device, select the requested sensing data from among pieces of sensing data received from at least one second electronic device, based on the received first template, in response to the request, convert the selected sensing data, based on the first template, to obtain converted sensing data, and provide a response message including the converted sensing data to the first electronic device.

    SYSTEMS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES

    公开(公告)号:US20200065453A1

    公开(公告)日:2020-02-27

    申请号:US16670282

    申请日:2019-10-31

    Abstract: Patterns in an integrated circuit may be evaluated, and a semiconductor device may be fabricated based on the evaluation. The evaluation may include a extracting and superimposing first patterns corresponding to design patterns of the same shape from input layout data generated based on inspecting the integrated circuit, generating distribution data of the first patterns based on the superimposed first patterns, determining an evaluation contour of the design patterns based on an evaluation condition and the distribution data, and generating output layout data based on replacing the first patterns with second patterns each having the evaluation contour. Weak points in the integrated circuit may be detected based on the output layout data. The fabricating may include selectively incorporating an integrated circuit into a semiconductor device based on a determination that the integrated circuit includes less than a threshold quantity and/or threshold concentration of weak points.

    SYSTEMS AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES

    公开(公告)号:US20180101637A1

    公开(公告)日:2018-04-12

    申请号:US15716856

    申请日:2017-09-27

    CPC classification number: G06F17/5081

    Abstract: Patterns in an integrated circuit may be evaluated, and a semiconductor device may be fabricated based on the evaluation. The evaluation may include a extracting and superimposing first patterns corresponding to design patterns of the same shape from input layout data generated based on inspecting the integrated circuit, generating distribution data of the first patterns based on the superimposed first patterns, determining an evaluation contour of the design patterns based on an evaluation condition and the distribution data, and generating output layout data based on replacing the first patterns with second patterns each having the evaluation contour. Weak points in the integrated circuit may be detected based on the output layout data. The fabricating may include selectively incorporating an integrated circuit into a semiconductor device based on a determination that the integrated circuit includes less than a threshold quantity and/or threshold concentration of weak points.

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