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    MEMORY MODULE AND MEMORY SYSTEM HAVING THE SAME
    2.
    发明申请
    MEMORY MODULE AND MEMORY SYSTEM HAVING THE SAME 有权

    公开(公告)号：US20230035640A1

    公开(公告)日：2023-02-02

    申请号：US17938780

    申请日：2022-10-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyudong Lee ,  Young Yun ,  Sungjoo Park ,  Jinseong Yun

    IPC: G11C5/14

    Abstract: A memory module includes a serial presence detector (SPD) configured to detect a module identification (ID) through at least one module position identification terminal, and generate at least one of the module ID and a register address corresponding to the module ID. A power management unit (PMU) is responsive to at least one of the module ID and the register address generated by the SPD. The PMU is configured to set an on-time point and/or an off-time point of an internal clock signal based on at least one of the module ID and the register address corresponding to the module ID, and further configured to generate at least one internal power supply voltage in response to the internal clock signal. A plurality of memory devices are also provided, which are configured to receive the at least one internal power supply voltage and perform an operation in response to command/address signals.

    MEMORY MODULE AND MEMORY SYSTEM HAVING THE SAME
    3.
    发明申请
    MEMORY MODULE AND MEMORY SYSTEM HAVING THE SAME 审中-公开

    公开(公告)号：US20200342917A1

    公开(公告)日：2020-10-29

    申请号：US16709984

    申请日：2019-12-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyudong Lee ,  Young Yun ,  Sungjoo Park ,  Jinseong Yun

    IPC: G11C5/14

    Abstract: A memory module includes a serial presence detector (SPD) configured to detect a module identification (ID) through at least one module position identification terminal, and generate at least one of the module ID and a register address corresponding to the module ID. A power management unit (PMU) is responsive to at least one of the module ID and the register address generated by the SPD. The PMU is configured to set an on-time point and/or an off-time point of an internal clock signal based on at least one of the module ID and the register address corresponding to the module ID, and further configured to generate at least one internal power supply voltage in response to the internal clock signal. A plurality of memory devices are also provided, which are configured to receive the at least one internal power supply voltage and perform an operation in response to command/address signals.

    SEMICONDUCTOR MEMORY MODULES INCLUDING POWER MANAGEMENT INTEGRATED CIRCUITS
    4.
    发明申请
    SEMICONDUCTOR MEMORY MODULES INCLUDING POWER MANAGEMENT INTEGRATED CIRCUITS 审中-公开

    公开(公告)号：US20200335140A1

    公开(公告)日：2020-10-22

    申请号：US16727066

    申请日：2019-12-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoo-Jeong Kwon ,  Jinseong Yun ,  Kyudong Lee

    IPC: G11C5/14 ,  G11C5/04

    Abstract: A semiconductor memory module includes a memory printed circuit board (PCB) that includes first connectors, a second connector, and a third connector configured to be connectable with an external device, memory devices that are mounted on the memory PCB and are connected with the first connectors, and a power management integrated circuit that is mounted on the memory PCB, receives a first voltage through the second connector, generates a second voltage from the first voltage, and supplies the second voltage to the memory devices. The power management integrated circuit adjusts the second voltage depending on a difference between a signal received through the third connector and the second voltage.

    Semiconductor memory modules including power management integrated circuits
    9.
    发明授权
    Semiconductor memory modules including power management integrated circuits 有权

    公开(公告)号：US10998012B2

    公开(公告)日：2021-05-04

    申请号：US16727066

    申请日：2019-12-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yoo-Jeong Kwon ,  Jinseong Yun ,  Kyudong Lee

    IPC: G11C5/14 ,  G11C5/04

    Abstract: A semiconductor memory module includes a memory printed circuit board (PCB) that includes first connectors, a second connector, and a third connector configured to be connectable with an external device, memory devices that are mounted on the memory PCB and are connected with the first connectors, and a power management integrated circuit that is mounted on the memory PCB, receives a first voltage through the second connector, generates a second voltage from the first voltage, and supplies the second voltage to the memory devices. The power management integrated circuit adjusts the second voltage depending on a difference between a signal received through the third connector and the second voltage.

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