公开(公告)号：US20200321229A1

公开(公告)日：2020-10-08

申请号：US16761905

申请日：2018-12-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Byunghoon LEE ,  Min PARK ,  Kyungwoon JANG ,  Jeonggen YOON ,  Hyuntae JANG

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90

Abstract: Introduced is a micro-chip gripper comprising: a pin plate of which one surface is coupled to another apparatus; a hole plate of which one surface faces the other surface of the pin plate while being disposed to be spaced apart therefrom by a fixed distance, and which is driven together with the drive of the pin plate, and in which a plurality of holes making a fixed pattern are formed; pins which are inserted into the holes of the hole plate and of which one end part is supported by the pin plate; and an adhesion layer which covers the other surface of the hole plate. Other embodiments are possible.

公开(公告)号：US20210136966A1

公开(公告)日：2021-05-06

申请号：US16638645

申请日：2018-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Tae JANG ,  Min PARK ,  Byung Hoon LEE ,  Youngchul LEE ,  Changjoon LEE ,  Jiyoung JANG ,  Youngjun MOON ,  Minyoung PARK ,  Jeonggen YOON ,  Won CHOI ,  Siho JANG

IPC: H05K13/04 ,  H01L33/00 ,  H05K13/02

Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

公开(公告)号：US20250159844A1

公开(公告)日：2025-05-15

申请号：US18946026

申请日：2024-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Boram KIM ,  Ohhyuck KWON ,  Youngjin KIM ,  Min PARK ,  Jungoh SUNG ,  Changjong SON ,  Yoonhee CHANG ,  Jinhwan JUNG ,  Jieun HWANG ,  Jihyeon SON ,  Jeonggen YOON

IPC: H05K7/20 ,  H05K9/00

Abstract: The disclosure relates to an electronic device. An electronic device according to an embodiment of the disclosure may comprise: a printed circuit board, a first electronic component mounted on the printed circuit board, a second electronic component mounted in a first area of a surface of the first electronic component, and a thermoresponsive heat dissipation member comprising a heat dissipation material and contacting a second area of the surface of the first electronic component and a top surface of the second electronic component. The heat dissipation member is configured to be in a solid phase and is configured to be softened based on a temperature of the heat dissipation member.

公开(公告)号：US20200259056A1

公开(公告)日：2020-08-13

申请号：US16786514

申请日：2020-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin HONG ,  Gyuhwa KIM ,  Jeonggen YOON ,  Tackmo LEE ,  Gyun HEO ,  Youngjun MOON ,  Kyungwoon JANG

IPC: H01L33/62 ,  H01L25/16 ,  H01L27/12

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.