公开(公告)号：US12280466B2

公开(公告)日：2025-04-22

申请号：US17825449

申请日：2022-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyug Lee ,  Chae Lyoung Kim ,  Hoyoung Kim ,  Seungjun Lee

IPC: B24B37/04 ,  B24B37/07

Abstract: Disclosed are substrate polishing apparatuses, substrate polishing systems, and/or substrate polishing methods. The substrate polishing apparatus may include an electric field applying module, and a platen that rotates a polishing pad. The electric field applying module may include an inner electrode having a circular shape when viewed in plan. The platen may be on the inner electrode. A central axis of the inner electrode may be spaced apart from a central axis of the platen. The inner electrode may include a first electrode and a second electrode that may surround the first electrode and may have an annular shape.

公开(公告)号：US20230191555A1

公开(公告)日：2023-06-22

申请号：US17940403

申请日：2022-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chaelyoung Kim ,  Jinyoung Park ,  Jaehyug Lee ,  Hoyoung Kim

IPC: B24B37/04 ,  B24B37/10 ,  B24B57/02 ,  H01L21/3105

CPC classification number: B24B37/046 ,  B24B37/105 ,  B24B37/044 ,  B24B57/02 ,  H01L21/31053 ,  H01L21/3212

Abstract: A chemical mechanical polishing apparatus, includes: a platen having a polishing pad attached to an upper surface thereof, and rotatably installed in one direction by a driving means, a slurry supply unit supplying a slurry including an abrasive and an additive having a zeta potential of a first polarity to the polishing pad, an electrode disposed below the polishing pad, a power supply unit applying a voltage including a DC pulse of a second polarity, opposite to the first polarity, to the electrode, and a polishing head installed on the polishing pad, and rotating a semiconductor substrate in contact with the polishing pad.

公开(公告)号：US09696083B2

公开(公告)日：2017-07-04

申请号：US14885551

申请日：2015-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Dae Whan Kim ,  Keon Kuk ,  Tae-Ho Song ,  Sung-Kie Youn ,  Kang Wonkyeong ,  Pilseong Kang ,  Yeo Inseok ,  Jaehyug Lee ,  Gil-Eon Jeong ,  Choi Bongsu

IPC: F25D23/00 ,  F25D23/06 ,  F25D25/00

CPC classification number: F25D23/065 ,  F25D23/063 ,  F25D25/00 ,  F25D2201/14

Abstract: Disclosed herein is a refrigerator which has an improved structure to increase insulating properties. The refrigerator includes a body including an inner casing and an outer casing, a storage compartment formed in the inner casing, an insulator provided between the inner casing and the outer casing to insulate the storage compartment, and a frame unit which is disposed between the adjacent insulators to ensure stiffness of the body and includes at least one coupling surface coupled with at least one of the inner casing and the outer casing.