公开(公告)号：US11317256B2

公开(公告)日：2022-04-26

申请号：US16876782

申请日：2020-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Su-A Baek ,  Kyung-Ae Lim ,  Seung-Chul Choi ,  Jae-Won Chang

IPC: H04W4/12 ,  H04M1/72403 ,  H04M1/72448 ,  H04M1/72484 ,  H04M1/57 ,  G06F3/04817 ,  H04M1/7243

Abstract: A method of, and a mobile terminal configured for, efficiently displaying an event indication in the form of a pop-up box during idle mode of a mobile terminal is provided. Upon occurrence of a second event in idle mode, it is determined whether an event pop-up box indicating an occurrence of a first event of the same type as the second event exists. When the event pop-up box indicating the occurrence of the first event exists, the event pop-up box is updated with information indicating the occurrence of the second event and displayed on a display.

公开(公告)号：US09773699B2

公开(公告)日：2017-09-26

申请号：US15000302

申请日：2016-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Jin Lee ,  Rak-Hwan Kim ,  Byung-Hee Kim ,  Jin-Nam Kim ,  Tsukasa Matsuda ,  Wan-Soo Park ,  Nae-In Lee ,  Jae-Won Chang ,  Eun-Ji Jung ,  Jeong-Ok Cha ,  Jae-Won Hwang ,  Jung-Ha Hwang

IPC: H01L21/76 ,  H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L21/76882 ,  H01L21/76807 ,  H01L21/76843 ,  H01L21/76864 ,  H01L21/76877 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/5283 ,  H01L23/53238

Abstract: In a method of forming a wiring structure, a lower structure is formed on a substrate. An insulating interlayer is formed on the lower structure. The insulating interlayer is partially removed to form at least one via hole and a dummy via hole. An upper portion of the insulating interlayer is partially removed to form a trench connecting the via hole and the dummy via hole. A first metal layer filling the via hole and the dummy via hole is formed. A second metal layer filling the trench is formed on the first metal layer.

公开(公告)号：US10347576B2

公开(公告)日：2019-07-09

申请号：US15709947

申请日：2017-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Won Choi ,  Sang-Woo Pae ,  Seong-Won Jeong ,  Min-Jae Kwon ,  Da-Hye Min ,  Jin-Chul Park ,  Jae-Won Chang

IPC: H01L23/498 ,  H01L23/053 ,  H01L23/13 ,  H01L23/20 ,  H01L23/24 ,  H01L23/31 ,  H01L23/00 ,  H01L23/16 ,  H01L21/56

Abstract: A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.

公开(公告)号：US10681508B2

公开(公告)日：2020-06-09

申请号：US15613784

申请日：2017-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Su-A Baek ,  Kyung-Ae Lim ,  Seung-Chul Choi ,  Jae-Won Chang

IPC: H04W4/12 ,  H04M1/725 ,  H04M1/57 ,  G06F3/0481

Abstract: A method of, and a mobile terminal configured for, efficiently displaying an event indication in the form of a pop-up box during idle mode of a mobile terminal is provided. Upon occurrence of a second event in idle mode, it is determined whether an event pop-up box indicating an occurrence of a first event of the same type as the second event exists. When the event pop-up box indicating the occurrence of the first event exists, the event pop-up box is updated with information indicating the occurrence of the second event and displayed on a display.