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公开(公告)号:US10347576B2
公开(公告)日:2019-07-09
申请号:US15709947
申请日:2017-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kwang-Won Choi , Sang-Woo Pae , Seong-Won Jeong , Min-Jae Kwon , Da-Hye Min , Jin-Chul Park , Jae-Won Chang
IPC: H01L23/498 , H01L23/053 , H01L23/13 , H01L23/20 , H01L23/24 , H01L23/31 , H01L23/00 , H01L23/16 , H01L21/56
Abstract: A semiconductor package includes a package substrate, the package substrate including a conductive plate, an insulating plate on the conductive plate, the insulating plate including a mounting region and a peripheral region surrounding the mounting region, and at least one capillary channel in the peripheral region, a semiconductor chip on the mounting region of the insulating plate, and a molding member on the insulating plate to cover the semiconductor chip, a portion of the molding member being in the at least one capillary channel.