公开(公告)号：US20180166122A1

公开(公告)日：2018-06-14

申请号：US15889783

申请日：2018-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C7/10 ,  G11C11/4093

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  G11C2207/105

Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

公开(公告)号：US20220366969A1

公开(公告)日：2022-11-17

申请号：US17875865

申请日：2022-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C11/4093 ,  G11C7/10

Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.

公开(公告)号：US20190272867A1

公开(公告)日：2019-09-05

申请号：US16289747

申请日：2019-03-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C7/10 ,  G11C11/4093

Abstract: An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.

公开(公告)号：US20180315468A1

公开(公告)日：2018-11-01

申请号：US16032837

申请日：2018-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoon-Joo EOM ,  JOON-YOUNG PARK ,  YONGCHEOL BAE ,  WON YOUNG LEE ,  SEONGJIN JANG ,  JUNGHWAN CHOI ,  JOOSUN CHOI

IPC: G11C11/4096 ,  G11C11/4093 ,  G11C7/10

CPC classification number: G11C11/4096 ,  G11C7/1084 ,  G11C11/4093 ,  G11C2207/105

Abstract: A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

公开(公告)号：US20140146589A1

公开(公告)日：2014-05-29

申请号：US13832996

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHULSUNG PARK ,  DONGSOO JUN ,  JOOSUN CHOI

IPC: G11C5/02

CPC classification number: G11C11/4076 ,  G06F12/0893 ,  G06F2212/3042 ,  G11C2207/2245

Abstract: A semiconductor memory device is provided which includes a dynamic random access memory including a memory cell array formed of dynamic random access memory cells; a cache memory formed at the same chip as the dynamic random access memory and configured to communicate with a processor or an external device; and a controller connected with the dynamic random access memory and the cache memory in the same chip and configured to control a dynamic random access function and a cache function.

Abstract translation: 提供一种半导体存储器件，其包括动态随机存取存储器，其包括由动态随机存取存储器单元形成的存储单元阵列; 高速缓冲存储器，其形成在与所述动态随机存取存储器相同的芯片处，并被配置为与处理器或外部设备进行通信; 以及与同一芯片中的动态随机存取存储器和高速缓冲存储器连接的控制器，用于控制动态随机存取功能和高速缓存功能。