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    Module board and memory module including the same
    2.
    发明授权
    Module board and memory module including the same 有权

    公开(公告)号：US11523506B2

    公开(公告)日：2022-12-06

    申请号：US17345815

    申请日：2021-06-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jaekwang Lee ,  Dongmin Jang ,  Hwanwook Park ,  Jaeseok Jang ,  Dohyung Kim

    IPC: H05K1/14 ,  H05K1/11

    Abstract: A module board is provided. The module board includes a plurality of first left terminals and a plurality of first right terminals. Each of the plurality of first left terminals includes a left upper body, a left lower body, and a left lower bar which are connected to one another and sequentially provided, each of the plurality of first right terminals includes a right upper body, a right lower body, and a right lower bar which are connected to one another and sequentially provided, and a first width of each of the left upper body and the right upper body is greater than a second width of each of the left lower bar and the right lower bar.

    Multi-level printed circuit boards and memory modules including the same
    6.
    发明授权
    Multi-level printed circuit boards and memory modules including the same 有权

    公开(公告)号：US12075560B2

    公开(公告)日：2024-08-27

    申请号：US17741510

    申请日：2022-05-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong-Hyun Seok ,  Yong-Jin Kim ,  Kyeongseon Park ,  Hwanwook Park

    IPC: H05K1/02 ,  H01P3/08 ,  H01L25/18 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/025 ,  H01P3/08 ,  H01L25/18 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09672 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545

    Abstract: A printed circuit board includes a first electrically conductive reference plane configured to distribute a first reference voltage applied thereto across a surface area of the first reference plane, and a second electrically conductive reference plane extending parallel to the first reference plane, and configured to distribute a second reference voltage applied thereto across a surface area of the second reference plane. A first layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more first signal lines extending adjacent the first reference plane. The first layer is divided into: (i) a first region in which the one or more first signal lines are disposed, (ii) a second region containing an additional plane that is configured to receive a third voltage and has smaller surface area relative to the surface areas of the first and second reference planes, and (iii) a third region containing a dielectric layer. A second layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more second signal lines extending adjacent the second reference plane. The second signal lines have linewidths that vary as a function of whether they are vertically aligned with the first region, the second region, or the third region.

    Printed circuit board and semiconductor module including the same
    8.
    发明授权
    Printed circuit board and semiconductor module including the same 有权

    公开(公告)号：US11758652B2

    公开(公告)日：2023-09-12

    申请号：US17360417

    申请日：2021-06-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongyoon Seo ,  Geunje Park ,  Dohyung Kim ,  Hwanwook Park ,  Dongmin Jang ,  Jaeseok Jang

    IPC: H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/09745

    Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.

    MULTI-LEVEL PRINTED CIRCUIT BOARDS AND MEMORY MODULES INCLUDING THE SAME
    9.
    发明申请
    MULTI-LEVEL PRINTED CIRCUIT BOARDS AND MEMORY MODULES INCLUDING THE SAME 有权

    公开(公告)号：US20230065980A1

    公开(公告)日：2023-03-02

    申请号：US17741510

    申请日：2022-05-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jong-Hyun Seok ,  Yong-Jin Kim ,  Kyeongseon Park ,  Hwanwook Park

    IPC: H05K1/02 ,  H01P3/08

    Abstract: A printed circuit board includes a first electrically conductive reference plane configured to distribute a first reference voltage applied thereto across a surface area of the first reference plane, and a second electrically conductive reference plane extending parallel to the first reference plane, and configured to distribute a second reference voltage applied thereto across a surface area of the second reference plane. A first layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more first signal lines extending adjacent the first reference plane. The first layer is divided into: (i) a first region in which the one or more first signal lines are disposed, (ii) a second region containing an additional plane that is configured to receive a third voltage and has smaller surface area relative to the surface areas of the first and second reference planes, and (iii) a third region containing a dielectric layer. A second layer is provided, which extends between the first reference plane and the second reference plane, and includes one or more second signal lines extending adjacent the second reference plane. The second signal lines have linewidths that vary as a function of whether they are vertically aligned with the first region, the second region, or the third region.

    Module board and memory module including the same
    10.
    发明授权
    Module board and memory module including the same 有权

    公开(公告)号：US11477880B2

    公开(公告)日：2022-10-18

    申请号：US17337850

    申请日：2021-06-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Wonseop Lee ,  Hwanwook Park ,  Jeonghoon Baek ,  Dohyung Kim ,  Seunghee Mun ,  Dongyoon Seo ,  Jinoh Ahn

    IPC: H05K1/02 ,  H01L25/11 ,  H01L25/065 ,  G11C5/04 ,  G11C5/06 ,  G11C8/18 ,  G06F13/40

    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

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