公开(公告)号：US20210167055A1

公开(公告)日：2021-06-03

申请号：US17105890

申请日：2020-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Huigyeong AHN ,  Kyoree LEE ,  Sangtae HAN ,  Changjun PARK

IPC: H01L25/18 ,  H01L23/498 ,  H01L27/12 ,  H01L33/62

Abstract: A printed circuit board (PCB) assembly of a micro light emitting diode (LED) display is provided. The PCB assembly includes a PCB including a first face disposed in a first direction and a second face disposed in a second direction opposite to the first direction, at least one thin film transistor (TFT) circuitry constructed directly on the first face, and a plurality of pixels arranged on the first face and electrically coupled to the at least one TFT circuitry.

公开(公告)号：US20220246089A1

公开(公告)日：2022-08-04

申请号：US17712687

申请日：2022-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun SONG ,  Sangtae HAN ,  Huigyeong AHN ,  Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Changjun PARK ,  Seunghee OH ,  Kyoree LEE ,  Mihyun LEE

IPC: G09G3/32

Abstract: A display apparatus is provided. The display apparatus includes a substrate having a data line disposed thereon, a plurality of pixel modules arranged in a matrix format on the substrate, and a driver providing a digital data signal through the data line to each of the pixel modules. Each of the pixel modules may include a light emitting layer in which a plurality of light emitting diode (LED) devices form a pixel, a driving layer comprising a display driver integrated circuit (DDI) below the light emitting layer and generating a driving signal to drive the LED devices, and a substrate layer, between the driving layer and the substrate, comprising a data input pad to receive the data signal and transmit the data signal to the DDI and a data output pad to provide the data signal to another adjacent pixel module.

公开(公告)号：US20220415873A1

公开(公告)日：2022-12-29

申请号：US17902611

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changsun KANG ,  Huigyeong AHN ,  Kyungwoon JANG ,  Sangtae HAN ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  G09G3/20

Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.