公开(公告)号：US20230223388A1

公开(公告)日：2023-07-13

申请号：US18121939

申请日：2023-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Tackmo LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075

CPC classification number: H01L25/167 ,  H01L25/0753

Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.

公开(公告)号：US20230253388A1

公开(公告)日：2023-08-10

申请号：US18134908

申请日：2023-04-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Gyun HEO ,  Tackmo LEE ,  Kyungwoon JANG ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L33/62 ,  G09G3/32

CPC classification number: H01L25/167 ,  H01L33/62 ,  G09G3/32 ,  G09G2300/026 ,  G09G2300/0842 ,  G09G2300/0426 ,  G09G2300/0452

Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.

公开(公告)号：US20240265839A1

公开(公告)日：2024-08-08

申请号：US18638228

申请日：2024-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjoon LEE ,  Jinyoung KIM ,  Sungyong MIN ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Daesuck HWANG

IPC: G09G3/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC classification number: G09G3/006 ,  H01L25/0753 ,  H01L33/382 ,  H01L33/62 ,  G09G2330/12

Abstract: An electroluminescence inspection apparatus includes a first substrate; a plurality of electrodes provided at a first surface of the first substrate; a driving circuit provided at a second surface of the first substrate opposite of the first surface and configured to apply a current to a plurality of light emitting diodes provided at a second substrate through the plurality of electrodes; and a plurality of wirings configured to electrically connect the plurality of electrodes with the driving circuit. At least one electrode of the plurality of electrodes includes a plurality of protrusions configured to contact the plurality of light emitting diodes of the second substrate.

公开(公告)号：US20220415873A1

公开(公告)日：2022-12-29

申请号：US17902611

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changsun KANG ,  Huigyeong AHN ,  Kyungwoon JANG ,  Sangtae HAN ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  G09G3/20

Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.

公开(公告)号：US20220149112A1

公开(公告)日：2022-05-12

申请号：US17524421

申请日：2021-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daesuck HWANG ,  Kyungwoon JANG ,  Changkyu CHUNG ,  Gyun HEO ,  Soonmin HONG

IPC: H01L27/15 ,  H01L33/00

Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.

公开(公告)号：US20200152721A1

公开(公告)日：2020-05-14

申请号：US16680764

申请日：2019-11-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon LEE ,  Kyungwoon JANG ,  Gyun HEO ,  Youngjun MOON ,  Kwangrae JO ,  Soonmin HONG ,  Daesuck HWANG

IPC: H01L27/32 ,  H05B33/10 ,  H05B33/08

Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.