Memory device including extra capacity and stacked memory device including the same

    公开(公告)号:US10032523B2

    公开(公告)日:2018-07-24

    申请号:US15450588

    申请日:2017-03-06

    Abstract: A memory device includes a memory cell array, a multiplexing circuit, and a control logic circuit. The memory cell array includes a first sub memory cell array, a second sub memory cell array, and a third sub memory cell array. The multiplexing circuit selects the first sub memory cell array, the second sub memory cell array, and the third sub memory cell array in a first mode of operation, and when the first sub memory cell array is defective in a second mode of operation, the multiplexing circuit selects the second sub memory cell array and the third sub memory cell array. The control logic circuit selects the first mode of operation or the second mode of operation. The control logic circuit controls the multiplexing circuit so that the first, second and third sub memory cell arrays are connected to input or output pads.

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