公开(公告)号：US20230408401A1

公开(公告)日：2023-12-21

申请号：US18194909

申请日：2023-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyeon Son ,  Jinwoo Ahn ,  Juntaek Oh ,  Hankyoul Moon ,  Myungjun Lee ,  Eunsoo Hwang

IPC: G01N21/21 ,  G01J4/04 ,  G01B11/24

CPC classification number: G01N21/211 ,  G01J4/04 ,  G01B11/24 ,  G01N2021/213

Abstract: In a method of measuring an alignment error, light is incident on a surface of a reference wafer having a known polarization transmittance at the surface. An image signal is obtained from the reference wafer at a set of angles including a first combination of values of a polarizer angle and an analyzer angle. Polarization transmittance of optical equipment including a polarizer and an analyzer is calculated from the image signal of the reference wafer. Light is incident on a surface of a measurement target wafer having a structure on the surface thereof. An image signal is obtained from the measurement wafer at a set of angles including a second combination of values of the polarizer angle and the analyzer angle. At least a portion of Mueller matrix is generated from the image signal of the measurement wafer.

公开(公告)号：US20240125709A1

公开(公告)日：2024-04-18

申请号：US18317387

申请日：2023-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donggun Lee ,  Jaewon Lee ,  Jinwoo Ahn ,  Juntaek Oh ,  Eunsoo Hwang

IPC: G01N21/88 ,  G01N21/47 ,  G01N21/55 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/47 ,  G01N21/55 ,  G01N21/9501 ,  G01N2021/8845

Abstract: A semiconductor measurement apparatus includes an illuminator configured to output light having a first wavelength band and light having a second wavelength band, different from the first wavelength band, a stage on which a test object is positioned, a camera configured to receive light reflected or scattered from the test object or transmitted through the test object, and a controller configured to control the illuminator and the camera, and to measure, based on information indicated by the light received by the camera, a plurality of structures included in the test object. The controller is configured to set an exposure time of the camera to a first exposure time while the illuminator outputs the light having the first wavelength band, and to set the exposure time of the camera to a second exposure time, different from the first exposure time, while the illuminator outputs the light having the second wavelength band.

公开(公告)号：US20250076116A1

公开(公告)日：2025-03-06

申请号：US18442539

申请日：2024-02-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunhong Jun ,  Sung Yoon Ryu ,  Younghoon Sohn ,  Eunsoo Hwang

IPC: G01J3/28 ,  G01J3/02

Abstract: An optical module includes: a diffraction grating configured to rotate and focus a beam, which is incident thereon from an incident path, onto a Fourier plane, a digital micromirror array (DMD) configured to assign a frequency for each wavelength of the focused beam received at the Fourier plane, and perform a Fourier transform for each frequency, and a first optical fiber configured to receive a beam that is reflected back from the DMD back and the diffraction grating, and along the incident path.

公开(公告)号：US12111270B2

公开(公告)日：2024-10-08

申请号：US17725917

申请日：2022-04-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Juntaek Oh ,  Jinwoo Ahn ,  Kijoo Hong ,  Youngkyu Park ,  Eunsoo Hwang

IPC: G01N21/95 ,  G01N21/21 ,  G01N21/55

CPC classification number: G01N21/9501 ,  G01N21/21 ,  G01N21/55 ,  G01N2201/121

Abstract: A method of inspecting a wafer comprising measuring an intensity of an incident light and storing the measurement as stored incident light intensity, irradiating the incident light to the wafer, measuring an intensity of a reflected light from the wafer and storing the measurement as stored reflected light intensity, and correcting the stored reflected light intensity based on a difference between the stored incident light intensity and a reference intensity of a reference incident light.

公开(公告)号：US20230204422A1

公开(公告)日：2023-06-29

申请号：US17955881

申请日：2022-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo Ahn ,  Juntaek Oh ,  Youngkyu Park ,  Eunsoo Hwang

IPC: G01J3/447 ,  G01N21/95 ,  G01N21/21 ,  G01J3/02

CPC classification number: G01J3/447 ,  G01N21/9501 ,  G01N21/211 ,  G01J3/021 ,  G01J3/0208 ,  G01N2021/213

Abstract: An imaging assembly of a spectral imaging ellipsometer includes an analyzer configured to polarize reflected light reflected from a sample surface, an imaging mirror optical system disposed on an optical path of the reflected light passing through the analyzer and including a first mirror having a concave surface and a second mirror having a convex surface, and a light detector configured to receive light passing through the imaging mirror optical system to collect spectral data. The reflected light is firstly reflected by the first mirror, the firstly reflected light is secondarily reflected by the second mirror and travels toward the first mirror again, and then thirdly reflected by the first mirror to be imaged on a light receiving surface of the light detector.