公开(公告)号：US10212808B2

公开(公告)日：2019-02-19

申请号：US15093111

申请日：2016-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Iksung Park ,  Heeyoub Kang ,  Young-Min Kim ,  Eunji You ,  Hwi-jong Yoo

IPC: H05K1/02 ,  H05K3/00 ,  H01L23/60 ,  H01L25/065 ,  H01L25/18 ,  H01L23/538 ,  G11C5/02 ,  G11C5/04 ,  G11C5/00

Abstract: Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked. The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.