公开(公告)号：US20240096851A1

公开(公告)日：2024-03-21

申请号：US18301403

申请日：2023-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Unbyoung Kang ,  Jeonggi Jin ,  Gilman Kang ,  Juil Choi ,  Dongchul Han

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/12105 ,  H01L2224/32146 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06555

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor chip on the first redistribution structure and including a first through-electrode, a second semiconductor chip on the first semiconductor chip and including a central portion vertically overlapping the first semiconductor chip and an outer portion horizontally offset from a sidewall of the first semiconductor chip, a molding layer in contact with the first redistribution structure, the first semiconductor chip, and the second semiconductor chip, a second redistribution structure on the second semiconductor chip and the molding layer, a first vertical connection wire extending through the molding layer and extending from the first redistribution structure to the second redistribution structure, and a second vertical connection wire extending through the molding layer and extending from the first redistribution structure to the outer portion of the second semiconductor chip.