公开(公告)号：US20190051612A1

公开(公告)日：2019-02-14

申请号：US15869517

申请日：2018-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Iyong KIM ,  Hyun-soo CHUNG ,  Dong-hyeon JANG

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/34 ,  H01L23/538

CPC classification number: H01L23/552 ,  H01L23/345 ,  H01L23/367 ,  H01L23/4334 ,  H01L23/5384 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/0635

Abstract: A semiconductor package including a heat spreading layer having at least one hole, a first semiconductor chip below the heat spreading layer, a redistribution structure below the first semiconductor chip, a first mold layer between the heat spreading layer and the redistribution structure, a shielding wall extending from the redistribution structure and the heat spreading layer and surrounding the first semiconductor chip, and a first conductive pillar extending from the redistribution structure into the hole may be provided.