-
公开(公告)号：US12035055B2
公开(公告)日：2024-07-09
申请号：US18056839
申请日：2022-11-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Ki Min , Jung Yeon Kim , Keun Yung Byun , Tae Shick Wang , Jong Min You
CPC classification number: H04N23/843 , H04N25/11
Abstract: An image processing device comprises an image sensor including unit groups comprising a reference group and a conversion group each including pixels and color filters, and is configured to generate image data using the pixels, and an image signal processor which is configured to calculate a hash of the image data, and to select a filter corresponding to the hash to perform filtering, wherein the image signal processor includes a pixel index converter which is configured to convert indexes of the pixels based on a positional relationship between the pixels, a pixel property converter which is configured to convert the properties of the pixels and to convert the hash before conversion, and a filter coefficient converter which is configured to convert filter coefficients of the pixels based on the respective converted pixel index and the respective converted pixel property.
-
公开(公告)号：US11089242B2
公开(公告)日：2021-08-10
申请号：US16683883
申请日：2019-11-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong Ki Min , Moo Young Kim , Ji Hye Kim , Jong Min You , Kwang Hyun Lee , Joon Hyuk Im , Seong Yeong Jeong , Eun Je Hyun
IPC: H04N5/347 , H04N9/04 , H04N5/3745
Abstract: An RGBW image sensor, a binning method in an image sensor, and a computer readable medium for performing the method are provided, and the binning method in an image sensor includes selecting one or more binning target pixels for each of a red pixel, a green pixel, a blue pixel, and a white pixel, constituting a pixel array of an RGBW image sensor with a uniform array pattern, generating binning pixel data for each of the red pixel, the green pixel, the blue pixel, and the white pixel, based on pieces of pixel data corresponding to the binning target pixel, and rearranging pixels, represented by the binning pixel data, to be equal to the entirety or a portion of the uniform array pattern and to be equally spaced apart from each other.
-
公开(公告)号：US20200260008A1
公开(公告)日：2020-08-13
申请号：US16537675
申请日：2019-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： YONG SEONG KIM , Da Hee Lee , Young Mi Jo , Dong Ki Min , Joon Hyuk Im
Abstract: An image sensor includes a pixel array that includes a plurality of pixels, a first interface directly connected to an external gyro sensor and that receives gyro data output by the gyro sensor in response to motion, and a control logic that generates image data by exposing the plurality of pixels for a predetermined exposure period, generates valid data that correspond to the exposure period using the gyro data, and generates, based on the valid data, compensation information that represents a movement path of the motion.
-
4.发明授权Binary CMOS image sensors, methods of operating same, and image processing systems including same 有权二进制CMOS图像传感器，操作方法以及包括其的图像处理系统公开(公告)号：US09177987B2
公开(公告)日：2015-11-03
申请号：US14051179
申请日：2013-10-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae-Yon Lee , Ju Hwan Jung , Seok Yong Hong , Tae-Chan Kim , Dong Ki Min , Yoon Dong Park , Sang-Chul Sul , Tae-Seok Oh , Je Il Ryu , Kwang-Hyun Lee , Young-Gu Jin
IPC: H01L27/00 , H01L27/146 , H04N5/376
CPC classification number: H01L27/14643 , H01L27/14612 , H01L27/1464 , H04N5/3765
Abstract: A binary complementary metal-oxide-semiconductor (CMOS) image sensor includes a pixel array and a readout circuit. The pixel array includes at least one pixel having a plurality of sub-pixels. The readout circuit is configured to quantize a pixel signal output from the pixel using a reference signal. The pixel signal corresponds to sub-pixel signals output from sub-pixels, from among the plurality of sub-pixels, activated in response to incident light.
Abstract translation: 二元互补金属氧化物半导体（CMOS）图像传感器包括像素阵列和读出电路。 像素阵列包括具有多个子像素的至少一个像素。 读出电路被配置为使用参考信号量化从像素输出的像素信号。 像素信号对应于从子像素输出的子像素信号，从响应于入射光激活的多个子像素之中。
-
Patent Agency Ranking
公开(公告)号：US11032476B2
公开(公告)日：2021-06-08
申请号：US16537675
申请日：2019-08-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Seong Kim , Da Hee Lee , Young Mi Jo , Dong Ki Min , Joon Hyuk Im
Abstract: An image sensor includes a pixel array that includes a plurality of pixels, a first interface directly connected to an external gyro sensor and that receives gyro data output by the gyro sensor in response to motion, and a control logic that generates image data by exposing the plurality of pixels for a predetermined exposure period, generates valid data that correspond to the exposure period using the gyro data, and generates, based on the valid data, compensation information that represents a movement path of the motion.
-
6.发明授权公开(公告)号：US09967453B2
公开(公告)日：2018-05-08
申请号：US15333336
申请日：2016-10-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dae Kwan Kim , Se Hwan Yun , Chae Sung Kim , Dong Ki Min
CPC classification number: H04N5/23212 , H04N5/2173
Abstract: An autofocus method includes receiving a left image having a first blurriness value and a right image having a second blurriness value, filtering the left image so that the first blurriness value becomes the same as the second blurriness value, and generating a control signal for controlling the lens module based on a difference between a third blurriness value of a filtered left image and the second blurriness value.
-
公开(公告)号：US09823067B2
公开(公告)日：2017-11-21
申请号：US14448673
申请日：2014-07-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dong Ki Min , Wang Hyun Kim , Sun Hwa Jung , Tae Chan Kim , Hye Kyoung Jung
CPC classification number: G01C3/08 , G01S7/4914 , G01S17/32 , G01S17/89
Abstract: A method of calculating, using a depth sensor, a distance excluding an ambiguity distance including outputting a modulated light signal output from a light source to an object, receiving the modulated light signal reflected by the object, calculating a distance between the light source and the object using the reflected modulated light signal input to photo gates in conjunction with demodulation signals supplied to the photo gates, the calculating including calculating, using the modulated light signal, at least one distance farther than a maximum measurable distance, and setting the at least one distance to be equal to the maximum measurable distance may be provided. A range of the distance farther than the maximum measurable distance can be determined according to a duty ratio of the modulated light signal.
-
公开(公告)号：US10211245B2
公开(公告)日：2019-02-19
申请号：US15625117
申请日：2017-06-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Chan Kim , Dong Ki Min , Kwang Hyun Lee , Yo Hwan Noh , Se Hwan Yun , Dae Kwan Kim , Young Jin Kim , Wang Hyun Kim , Hyuk Soon Choi
IPC: H01L27/146 , H04N5/374 , H04N9/04 , G02B5/20 , G02B3/00 , H04N5/347 , H04N5/353 , H04N5/355 , H04N5/378 , H04N5/3745
Abstract: An image sensor according to an example embodiment concepts includes a pixel array including pixels, and each of the pixels includes photoelectric conversion elements. The photoelectric conversion elements independently operating to detect a phase difference. The image sensor further includes a control circuit configured to independently control exposure times of each of the photoelectric conversion elements included in each of the pixels.
-
公开(公告)号：US09432604B2
公开(公告)日：2016-08-30
申请号：US14051993
申请日：2013-10-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Chan Kim , Min Ho Kim , Dong Ki Min , Sang Chul Sul , Tae Seok Oh , Kwang Hyun Lee , Tae Yon Lee , Jung Hoon Jung , Young Gu Jin
IPC: H04N5/335 , H04N5/225 , H01L31/062 , H01L27/14 , H04N5/374 , H01L27/146
CPC classification number: H04N5/374 , H01L27/14627 , H01L27/14634
Abstract: An image sensor chip includes a first wafer and a second wafer. The first wafer includes an image sensor having a plurality of sub-pixels, each of which is configured to detect at least one photon and output a sub-pixel signal according to a result of the detection. The image processor is configured to process sub-pixel signals for each sub-pixel and generate image data. The first wafer and the second wafer are formed in a wafer stack structure.
Abstract translation: 图像传感器芯片包括第一晶片和第二晶片。 第一晶片包括具有多个子像素的图像传感器，每个子像素被配置为检测至少一个光子并根据检测结果输出子像素信号。 图像处理器被配置为处理每个子像素的子像素信号并生成图像数据。 第一晶片和第二晶片形成为晶片堆叠结构。
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.017 seconds)
