公开(公告)号：US20150230029A1

公开(公告)日：2015-08-13

申请号：US14317135

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seog-woo HONG ,  Hyung-jae SHIN ,  Dong-sik SHIM ,  Byung-gil JEONG ,  Seok-whan CHUNG

IPC: H04R23/00

CPC classification number: H04R23/00 ,  B06B1/0292 ,  B06B1/0685 ,  G10K11/002 ,  H04R2201/003

Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.

Abstract translation: 一种电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与该导电衬底相对设置并且设置有至少一个对应于该电极的焊盘的焊盘衬底，其中至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。

公开(公告)号：US20150054095A1

公开(公告)日：2015-02-26

申请号：US14298195

申请日：2014-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-gil JEONG ,  Seog-woo HONG

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00888 ,  B06B1/0292 ,  B81B2201/0271 ,  H04R19/005

Abstract: A capacitive micro-machined ultrasonic transducer (CMUT) and a method of singulating the same. Singulating CMUTs may include forming first trenches in regions of a device wafer defining a plurality of ultrasonic transducer structures, the device wafer including a plurality of the ultrasonic transducer structures, forming an ultrasonic transducer wafer having a plurality of ultrasonic transducers by bonding an electrode pad wafer supplying electricity to the plurality of ultrasonic transducers and the device wafer, and dicing the ultrasonic transducer wafer to form the plurality of ultrasonic transducers by cutting the plurality of ultrasonic transducer structures on the first trench and the electrode pad wafer below the first trench.

Abstract translation: 一种电容微加工超声波换能器（CMUT）及其分离方法。 编码CMUT可以包括在限定多个超声换能器结构的器件晶片的区域中形成第一沟槽，器件晶片包括多个超声波换能器结构，通过将电极焊盘晶片结合形成具有多个超声换能器的超声换能器晶片 向所述多个超声波换能器和所述装置晶片供电;以及通过在所述第一沟槽下方的所述第一沟槽和所述电极焊盘晶片上切割所述多个超声波换能器结构来切割所述超声波换能器晶片以形成所述多个超声换能器。

公开(公告)号：US20140070669A1

公开(公告)日：2014-03-13

申请号：US13957759

申请日：2013-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-gil JEONG

IPC: B06B1/06 ,  B06B1/02

CPC classification number: B06B1/0629 ,  B06B1/0292

Abstract: A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.

Abstract translation: 微加工超声波换能器（MUT）阵列包括印刷电路板，形成在印刷电路板上的对准板，对准板上形成有多个空腔，多个突出部分分别形成在多个空腔的相邻空腔之间 以及多个MUT模块，形成在所述多个空腔和所述对准板的所述多个突出部分中。 在MUT阵列中，多个MUT模块中的每一个包括布置在对准板上的应用专用集成电路（ASIC）和布置在ASIC上的MUT。

公开(公告)号：US20150141795A1

公开(公告)日：2015-05-21

申请号：US14338507

申请日：2014-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-seok KIM ,  Sung-chan KANG ,  Hyung-joo KIM ,  Hyung-jae SHIN ,  Yong-seop YOON ,  Byung-gil JEONG ,  Seok-whan CHUNG ,  Chang-jung KIM

IPC: A61B5/00

CPC classification number: A61B5/0095 ,  A61B5/0091 ,  A61B5/708 ,  A61B8/0825 ,  A61B8/406 ,  A61B8/42

Abstract: A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.

Abstract translation: 提供了使用光声超声波的乳房扫描装置。 乳房扫描装置包括：主体，其包括彼此水平平行的第一孔和第二孔; 第一压缩板和第二压缩板，其中至少一个可相对于主体在垂直方向上移动; 第一滑动板和第二滑动板，其分别安装在第一压缩板和第二压缩板的表面上并且彼此面对并且可沿第一方向移动; 第一超声波换能器阵列在第一压缩板中并面向第一滑板; 以及第一压缩板中的第一激光头，其可沿与第一方向垂直的第二方向移动。

公开(公告)号：US20140061826A1

公开(公告)日：2014-03-06

申请号：US14012350

申请日：2013-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seog-woo HONG ,  Dong-kyun KIM ,  Byung-gil JEONG ,  Seok-whan CHUNG

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0027 ,  A61B8/4483 ,  B06B1/0292 ,  B06B2201/76 ,  B81C1/00158

Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.

Abstract translation: 公开了一种超声换能器及其制造方法。 超声波换能器包括：第一电极层，其设置成覆盖导电基底;内壁和通孔的顶部穿透膜，并且具有与膜的顶表面相同高度的顶表面; 第二电极层，设置在与第一电极层间隔开的导电基板的底表面上; 以及顶部电极，其设置在所述膜的顶表面上并与所述第一电极层的顶表面接触。