公开(公告)号：US20240071983A1

公开(公告)日：2024-02-29

申请号：US18227697

申请日：2023-07-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongken YU ,  Cheolsoo HAN ,  Kwangjin BAE ,  Youngjin JANG ,  Inwook JUNG ,  Minchul CHO

IPC: H01L23/00 ,  B23K3/06

CPC classification number: H01L24/75 ,  B23K3/0623 ,  H01L2224/75804

Abstract: A solder ball attaching apparatus includes a working die, having an internal space maintained in a vacuum state, and a plurality of lifting members installed on the working die to be movable upwardly and downwardly. The working die may be provided with an upper plate on which the lifting members are installed. The upper plate may be provided with an insertion groove, into which an upper end portion of the lifting member is inserted when the lifting member is lowered, and a locking groove into which a lower end portion of the lifting member is inserted when the lifting member is raised. The lifting member may be lowered by a chip when the chip is seated on the lifting member and may be raised by elastic restoring force when the chip is removed.

公开(公告)号：US20220157776A1

公开(公告)日：2022-05-19

申请号：US17588442

申请日：2022-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongken YU

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, a logic chip on an upper surface of the package substrate and electrically connected to the package substrate, a heat sink contacting an upper surface of the logic chip to dissipate a heat generating from the logic chip, and a memory chip disposed on an upper surface of the heat sink and electrically connected to the package substrate.

公开(公告)号：US20220020676A1

公开(公告)日：2022-01-20

申请号：US17198332

申请日：2021-03-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongken YU

IPC: H01L23/498 ,  H01L25/10 ,  H01L25/18 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor package that includes a support wiring structure. A semiconductor chip is on the support wiring structure. A cover wiring structure is on the semiconductor chip. A plurality of connection structures penetrates a filling member and electrically connects the support wiring structure to the cover wiring structure. The filling member fills a space between the support wiring structure and the cover wiring structure. The filling member surrounds the plurality of connection structures and the semiconductor chip and includes a plurality of fillers. A partial portion of the plurality of fillers includes cutting fillers having a flat surface that extends along a vertical level that is a reference level.

公开(公告)号：US20240290751A1

公开(公告)日：2024-08-29

申请号：US18651786

申请日：2024-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongken YU

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L25/0652 ,  H01L24/14 ,  H01L25/18 ,  H01L2224/14519 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes a package substrate, a logic chip on an upper surface of the package substrate and electrically connected to the package substrate, a heat sink contacting an upper surface of the logic chip to dissipate a heat generating from the logic chip, and a memory chip disposed on an upper surface of the heat sink and electrically connected to the package substrate.

公开(公告)号：US20230275014A1

公开(公告)日：2023-08-31

申请号：US18143750

申请日：2023-05-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bongken YU

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/31 ,  H01L21/56 ,  H01L25/10

CPC classification number: H01L23/49833 ,  H01L25/18 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49838 ,  H01L21/561 ,  H01L23/49811 ,  H01L25/105 ,  H01L23/295

Abstract: A semiconductor package that includes a support wiring structure. A semiconductor chip is on the support wiring structure. A cover wiring structure is on the semiconductor chip. A plurality of connection structures penetrates a filling member and electrically connects the support wiring structure to the cover wiring structure. The filling member fills a space between the support wiring structure and the cover wiring structure. The filling member surrounds the plurality of connection structures and the semiconductor chip and includes a plurality of fillers. A partial portion of the plurality of fillers includes cutting fillers having a flat surface that extends along a vertical level that is a reference level.