公开(公告)号：US20240178025A1

公开(公告)日：2024-05-30

申请号：US18217020

申请日：2023-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoong Choi ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Kyusang Lee ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/68

CPC classification number: H01L21/67288 ,  H01L21/67265 ,  H01L21/67742 ,  H01L21/681

Abstract: A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.

公开(公告)号：US12224191B2

公开(公告)日：2025-02-11

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20240353484A1

公开(公告)日：2024-10-24

申请号：US18591091

申请日：2024-02-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinhyuk Choi ,  Sumin Park ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Jayul Kim

IPC: G01R31/28

CPC classification number: G01R31/2891 ,  G01R31/2893

Abstract: A measuring apparatus for a semiconductor device includes a lower frame that provides a lower measurement space configured for performing a first measurement process, a lower measuring portion in the lower frame and configured to measure the first semiconductor substrate on a lower substrate stage, a lower vibration damping portion configured to offset a first vibration of the lower measuring portion with respect to a ground, an upper frame that provides an upper measurement space configured for performing a second measurement process, an upper measuring portion in the upper frame to measure a second semiconductor substrate=on an upper substrate stage, an upper vibration damping portion configured to offset a second vibration of the upper measuring portion with respect to the ground, and a plurality of support structures that support the upper frame such that the upper frame is spaced apart from the lower frame.

公开(公告)号：US20250073892A1

公开(公告)日：2025-03-06

申请号：US18639076

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongseong Ko ,  Pyungkang Kim ,  Junhyeok Park ,  Donghyun Kim ,  Jungjoon Park ,  Hyoin Kim ,  Jungjun Park ,  Kongwoo Lee ,  Hyunyoung Lee ,  Beomsoo Hwang ,  Seojoo Choi

IPC: B25J9/00 ,  B25J9/16 ,  B25J15/08

Abstract: Disclosed are a robot apparatus and a robot system. The robot apparatus includes a first robot unit supported by a frame structure and a second robot unit disposed under the frame structure and configured to move the first robot unit. The first robot unit includes first and second robot arms with first and second tool replacement portions. Tools to perform work are mounted on the replacement portions. A robot arm moving module is configured to move each of the first and second robot arms in a vertical direction. The robot system also includes a work table and a work table moving module configured to move the work table in all three directions. A controller inside the frame structure controls the movement of the robot arms and also of the work table.

公开(公告)号：US11920689B2

公开(公告)日：2024-03-05

申请号：US17572816

申请日：2022-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongkyu Kim ,  Kwangjun Kim ,  Beomsoo Hwang

IPC: F16K31/44 ,  F16K27/02

CPC classification number: F16K27/02 ,  F16K31/44

Abstract: A loose type pneumatic valve and a loose type pneumatic valve module, the loose type pneumatic valve including a valve body including a pneumatic passage therein; a valve head on the valve body, the valve head being coupleable with an actuator; a stem on the valve head, the stem being configured to open and close the pneumatic passage; and at least one alignment socket on the valve head, the at least one alignment socket being configured to align the valve head with the actuator.

公开(公告)号：US12264747B2

公开(公告)日：2025-04-01

申请号：US17724214

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: F16K3/02 ,  F16K27/00 ,  F16K51/02 ,  H01L21/67

Abstract: A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

公开(公告)号：US20240021452A1

公开(公告)日：2024-01-18

申请号：US18117259

申请日：2023-03-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomsoo Hwang ,  Kongwoo Lee ,  Myungki Song ,  Kyusang Lee ,  Seojoo Choi ,  Jinhyuk Choi

IPC: H01L21/67 ,  H01L21/687 ,  B65G47/90

CPC classification number: H01L21/67259 ,  H01L21/67201 ,  H01L21/68707 ,  B65G47/905 ,  B65G47/907

Abstract: A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

公开(公告)号：US20230230865A1

公开(公告)日：2023-07-20

申请号：US18062285

申请日：2022-12-06

Applicant: Samsung Electronics Co., Ltd

Inventor： Jinhyuk CHOI ,  Kongwoo Lee ,  Beomsoo Hwang ,  Myungki Song ,  Duckjin Kim ,  Kyusang Lee ,  Hyunjoo Jeon

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67201 ,  H01L21/67745

Abstract: A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.

公开(公告)号：US20230072147A1

公开(公告)日：2023-03-09

申请号：US17718574

申请日：2022-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Jonghwi Seo ,  Kongwoo Lee ,  Beomsoo Hwang

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

公开(公告)号：US12217984B2

公开(公告)日：2025-02-04

申请号：US17722838

申请日：2022-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinhyuk Choi ,  Myungki Song ,  Kongwoo Lee ,  Kyusang Lee ,  Beomsoo Hwang ,  Keonwoo Kim ,  Jonghwi Seo

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.