Invention Grant
- Patent Title: Loadlock apparatus and substrate processing apparatus including the same
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Application No.: US17724214Application Date: 2022-04-19
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Publication No.: US12264747B2Publication Date: 2025-04-01
- Inventor: Jinhyuk Choi , Kongwoo Lee , Beomsoo Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2021-0128349 20210928
- Main IPC: F16K3/02
- IPC: F16K3/02 ; F16K27/00 ; F16K51/02 ; H01L21/67

Abstract:
A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.
Public/Granted literature
- US20230097418A1 LOADLOCK APPARATUS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2023-03-30
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