Chip resistor
    3.
    发明授权
    Chip resistor 有权
    贴片电阻

    公开(公告)号:US09390844B2

    公开(公告)日:2016-07-12

    申请号:US14221822

    申请日:2014-03-21

    摘要: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

    摘要翻译: 芯片电阻器可以包括:具有堆叠在其中的多个基板的主体; 多个电阻器,其形成在主体中,各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极,并且分别连接到暴露的电阻器的两个端部。

    Multilayer ceramic electronic component
    4.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号:US08861181B2

    公开(公告)日:2014-10-14

    申请号:US13745124

    申请日:2013-01-18

    摘要: There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer, and T2 is a thickness of the second layer, Tc≦70 μm, T2≧(1.5)T1, and L1

    摘要翻译: 提供了一种多层陶瓷电子部件,其包括:层叠有内部电极的陶瓷主体; 以及在陶瓷主体的长度方向两端形成的外部电极,其中每个外部电极包括形成在陶瓷主体上并包括导电金属的第一层,以及形成在第一层上的第二层和 包括导电树脂,并且当Tc是陶瓷主体的覆盖层的厚度时,L1是从陶瓷主体的长度方向的任一端到在上表面形成的第一层的端部的长度 或陶瓷主体的下表面,T1为第一层的厚度,T2为第二层的厚度,Tc&nlE;70μm,T2≥(1.5)T1,L1 <(1.5)Tc满足 ,从而提供出色的可靠性。

    Coil unit for power inductor
    5.
    发明授权

    公开(公告)号:US10541083B2

    公开(公告)日:2020-01-21

    申请号:US16160325

    申请日:2018-10-15

    IPC分类号: H01F41/04 H01F5/00 H01F17/00

    摘要: The present invention relates to a coil unit for a power inductor, a manufacturing method of a coil unit for a power inductor, a power inductor and a manufacturing method of a power inductor. The coil unit includes an insulating substrate and a coil pattern, wherein the coil pattern has a first plating part formed at least one surface among top and bottom surfaces of the insulating substrate, wherein a top side thereof has the shape of a taper and a second plating part formed to encompass the first plating part and to correspond to a shape of the first plating part.

    CHIP RESISTOR
    6.
    发明申请
    CHIP RESISTOR 有权
    芯片电阻

    公开(公告)号:US20150170804A1

    公开(公告)日:2015-06-18

    申请号:US14221822

    申请日:2014-03-21

    IPC分类号: H01C1/148 H01C1/012

    摘要: A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.

    摘要翻译: 芯片电阻器可以包括:具有堆叠在其中的多个基板的主体; 多个电阻器,其形成在主体中,各自的基板插入其间并通过主体的两个端面露出; 以及分别覆盖主体的两个端面的第一和第二电极,并且分别连接到暴露的电阻器的两个端部。

    Array-type multilayer ceramic electronic component, board for mounting the same, and method of manufacturing the same
    7.
    发明授权
    Array-type multilayer ceramic electronic component, board for mounting the same, and method of manufacturing the same 有权
    阵列型多层陶瓷电子部件,其安装用基板及其制造方法

    公开(公告)号:US09024200B2

    公开(公告)日:2015-05-05

    申请号:US14060491

    申请日:2013-10-22

    发明人: Chang Ho Lee

    摘要: There is provided an array type multilayer ceramic electronic component including a ceramic body having a plurality of dielectric layers stacked in a length direction, a first capacitor part including a plurality of first and second internal electrodes alternately exposed through both side surfaces of the ceramic body, a second capacitor part disposed to be spaced apart from the first capacitor part and including a plurality of third and fourth internal electrodes, a first external electrode formed on one side surface, a second external electrode disposed to be spaced apart from the first external electrode, formed on one side surface of the ceramic body, and a third external electrode formed on the other side surface of the ceramic body.

    摘要翻译: 提供了一种阵列型多层陶瓷电子部件,其包括具有沿长度方向堆叠的多个电介质层的陶瓷体,包括通过陶瓷体的两个侧面交替露出的多个第一和第二内部电极的第一电容器部, 第二电容器部分设置成与第一电容器部分间隔开并且包括多个第三和第四内部电极,形成在一个侧表面上的第一外部电极,设置成与第一外部电极间隔开的第二外部电极, 形成在陶瓷体的一个侧面上,第三外部电极形成在陶瓷体的另一个侧面上。

    ARRAY-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ARRAY-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, BOARD FOR MOUNTING THE SAME, AND METHOD OF MANUFACTURING THE SAME 有权
    阵列型多层陶瓷电子元件,用于安装其的板及其制造方法

    公开(公告)号:US20150021076A1

    公开(公告)日:2015-01-22

    申请号:US14060491

    申请日:2013-10-22

    发明人: Chang Ho Lee

    IPC分类号: H01G4/30 H05K1/18 H01G2/06

    摘要: There is provided an array type multilayer ceramic electronic component including a ceramic body having a plurality of dielectric layers stacked in a length direction, a first capacitor part including a plurality of first and second internal electrodes alternately exposed through both side surfaces of the ceramic body, a second capacitor part disposed to be spaced apart from the first capacitor part and including a plurality of third and fourth internal electrodes, a first external electrode formed on one side surface, a second external electrode disposed to be spaced apart from the first external electrode, formed on one side surface of the ceramic body, and a third external electrode formed on the other side surface of the ceramic body.

    摘要翻译: 提供了一种阵列型多层陶瓷电子部件,其包括具有沿长度方向堆叠的多个电介质层的陶瓷体,包括通过陶瓷体的两个侧面交替露出的多个第一和第二内部电极的第一电容器部, 第二电容器部分设置成与第一电容器部分间隔开并且包括多个第三和第四内部电极,形成在一个侧表面上的第一外部电极,设置成与第一外部电极间隔开的第二外部电极, 形成在陶瓷体的一个侧面上,第三外部电极形成在陶瓷体的另一个侧面上。

    Multilayer ceramic electronic component
    10.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号:US09099245B2

    公开(公告)日:2015-08-04

    申请号:US13745094

    申请日:2013-01-18

    发明人: Chang Ho Lee

    摘要: A multilayer ceramic electronic component includes a ceramic main body having internal and floating electrode layers laminated therein and spaced apart from each other; and external electrodes formed on ends of the ceramic main body and including a first layer including a conductive metal and a second layer formed on the first layer and including a conductive resin. When Tc is thickness of a cover layer, G is gap between internal electrodes, L1 is length from either end of the ceramic main body in a length direction thereof to an end of the first layer formed on the upper or lower surface of the ceramic main body, Te is thickness of the internal electrode, Td is distance between internal and floating electrode layers, Lm is length of a margin part of the floating electrode layer, and L is length of the ceramic main body, Tc≦80 μm, (1.5)Lm≦G≦(L−2Lm), and L1

    摘要翻译: 多层陶瓷电子部件包括陶瓷主体,其具有层叠在其中并且彼此间隔开的内部和浮动电极层; 以及外部电极,形成在陶瓷主体的端部,并且包括形成在第一层上并包括导电树脂的包括导电金属和第二层的第一层。 当Tc是覆盖层的厚度时,G是内部电极之间的间隙,L1是从陶瓷主体的长度方向的任一端到形成在陶瓷主体的上表面或下表面上的第一层的端部的长度 主体,Te是内部电极的厚度,Td是内部和浮动电极层之间的距离,Lm是浮动电极层的边缘部分的长度,L是陶瓷主体的长度,Tc&nlE;80μm,(1.5 )Lm&nlE; G&nlE;(L-2Lm)和L1