- 专利标题: Composite electronic component, method of manufacturing the same, board for mounting thereof, and packaging unit thereof
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申请号: US16200468申请日: 2018-11-26
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公开(公告)号: US10770226B2公开(公告)日: 2020-09-08
- 发明人: Jin Hwan Kim , Dae Bok Oh , Jae Young Park , Ichiro Tanaka , Chang Ho Lee
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@3d2e0a6f
- 主分类号: H01G2/14
- IPC分类号: H01G2/14 ; H01G4/012 ; H01G4/248 ; H01G4/40 ; H05K1/18 ; H01G2/06 ; H01G2/22 ; H01G4/12 ; H01G4/30 ; H05K1/02 ; H05K3/34
摘要:
A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection device includes first and second electrodes disposed on the ceramic body, a discharging part disposed between the first and second electrodes, and a protective layer disposed on the first and second electrodes and the discharging part. An input terminal disposed on a first end surface of the composite body and is connected to internal electrodes and the first and second electrodes. A ground terminal formed on a second end surface of the composite body and is connected to internal electrodes and the first and second electrodes.
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