Invention Grant
- Patent Title: Chip resistor
- Patent Title (中): 贴片电阻
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Application No.: US14221822Application Date: 2014-03-21
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Publication No.: US09390844B2Publication Date: 2016-07-12
- Inventor: Sung Hun Cho , Young Key Joo Kim , Chang Ho Lee , Byung Sung Kang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0156607 20131216
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C7/00 ; H01C7/18 ; H01C17/00 ; H01C17/065
Abstract:
A chip resistor may include: a body having a plurality of substrates stacked therein; a plurality of resistors formed in the body with respective substrates interposed therebetween and exposed through both end surfaces of the body; and first and second electrodes covering both end surfaces of the body, respectively, and connected to both end portions of the exposed resistors, respectively.
Public/Granted literature
- US20150170804A1 CHIP RESISTOR Public/Granted day:2015-06-18
Information query
