公开(公告)号：US20190319082A1

公开(公告)日：2019-10-17

申请号：US16385297

申请日：2019-04-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ki-Soo NAM ,  Gi Young KANG

IPC: H01L27/32 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.

公开(公告)号：US20180157090A1

公开(公告)日：2018-06-07

申请号：US15661973

申请日：2017-07-27

Applicant: Samsung Display Co. Ltd.

Inventor： Ju Hwan KIM ,  Gi Young KANG ,  Sang Kyo SHIN ,  Hyun Woo LEE

IPC: G02F1/1333

CPC classification number: G02F1/133308 ,  G02B6/0088 ,  G02B6/009 ,  G02B6/0093 ,  G02F2001/133317 ,  G02F2001/133325 ,  G02F2001/133388 ,  G02F2201/066 ,  G02F2202/023 ,  G02F2202/28

Abstract: A display device includes: a display panel; a mold frame which supports the display panel, where the mold frame includes a frame body comprises a recessed portion, and a first light-transmit member extending in a first direction and at least partially inserted into the recessed portion; and a joining member which couples the display panel and the mold frame to each other, where the first light-transmit member and the joining member at least partially overlap each other.