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公开(公告)号:US20180154477A1
公开(公告)日:2018-06-07
申请号:US15831191
申请日:2017-12-04
Applicant: Samsung Display Co., Ltd.
Inventor: Kyung Hwan JUNG , Ju Hwan KIM , Sang Kyo SHIN , Gye Hwan LIM , Mun Sik CHOI
IPC: B23K13/02 , G02F1/1345 , G02F1/1333 , H05K3/36 , H05B6/44
Abstract: A bonding apparatus includes a support member configured to support a first substrate of a display panel and a connecting member, a bonding unit located above the support member and configured to compress the first substrate and the connecting member against each other using a bonding head to which a heating member is attached, and a magnetic-field generating part configured to generate a magnetic field to heat the heating member in an electromagnetic induction method.
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2.
公开(公告)号:US20180157090A1
公开(公告)日:2018-06-07
申请号:US15661973
申请日:2017-07-27
Applicant: Samsung Display Co. Ltd.
Inventor: Ju Hwan KIM , Gi Young KANG , Sang Kyo SHIN , Hyun Woo LEE
IPC: G02F1/1333
CPC classification number: G02F1/133308 , G02B6/0088 , G02B6/009 , G02B6/0093 , G02F2001/133317 , G02F2001/133325 , G02F2001/133388 , G02F2201/066 , G02F2202/023 , G02F2202/28
Abstract: A display device includes: a display panel; a mold frame which supports the display panel, where the mold frame includes a frame body comprises a recessed portion, and a first light-transmit member extending in a first direction and at least partially inserted into the recessed portion; and a joining member which couples the display panel and the mold frame to each other, where the first light-transmit member and the joining member at least partially overlap each other.
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