公开(公告)号：US20190319082A1

公开(公告)日：2019-10-17

申请号：US16385297

申请日：2019-04-16

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ki-Soo NAM ,  Gi Young KANG

IPC: H01L27/32 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

Abstract: A chip on film package includes: a base substrate having an output pad region; a plurality of output pads disposed in the output pad region of the base substrate, wherein the output pads are arranged in a zigzag configuration on the base substrate; a plurality of output pad wirings connected to the output pads, respectively; and a protection layer disposed on the output pad wirings. The protection layer is disposed on the output pad wirings disposed between two adjacent output pads, arranged in a first direction.