公开(公告)号：US11749146B2

公开(公告)日：2023-09-05

申请号：US17367574

申请日：2021-07-05

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee ,  Seungkyun Hong

IPC: H01L23/31 ,  G09G3/00 ,  H05K1/02 ,  G09G3/20 ,  G02F1/1345 ,  H01L23/482 ,  H01L23/498 ,  H05K1/18

CPC classification number: G09G3/006 ,  G02F1/13452 ,  G09G3/20 ,  H01L23/3114 ,  H01L23/4824 ,  H01L23/4985 ,  H05K1/0268 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2330/12 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10128

Abstract: A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.

公开(公告)号：US20180233436A1

公开(公告)日：2018-08-16

申请号：US15857744

申请日：2017-12-29

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee ,  Seungkyun Hong

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/482 ,  G02F1/1345

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  G09G3/006 ,  G09G3/20 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2330/12 ,  H01L23/3114 ,  H01L23/4824 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10128

Abstract: A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.

公开(公告)号：US11579741B2

公开(公告)日：2023-02-14

申请号：US17529679

申请日：2021-11-18

Applicant: Samsung Display Co., Ltd.

Inventor： Hirotsugu Kishimoto ,  Dasom Gu ,  Jaiku Shin ,  Yongchan Jeon ,  Sung-Ki Jung ,  Chul Ho Jeong ,  Seungkyun Hong ,  Hyun-Been Hwang

IPC: G06F3/046 ,  G06F3/044

Abstract: An electronic apparatus includes a display module divided into a first non-folding area, a folding area foldable along an imaginary folding axis extending in a second direction crossing a first direction, and a second non-folding area, which are sequentially arranged in the first direction, and a sensing sensor including a first base layer disposed under the display module, first sensing coils disposed on the first base layer, second sensing coils insulated from the first sensing coils, and a first cover layer disposed between the first sensing coils and the second sensing coils. The first cover layer has a modulus less than a modulus of the first base layer.

公开(公告)号：US11056027B2

公开(公告)日：2021-07-06

申请号：US16692122

申请日：2019-11-22

Applicant: Samsung Display Co., Ltd.

Inventor： Hee-Kwon Lee ,  Seungkyun Hong

IPC: H01L23/48 ,  G09G3/00 ,  H05K1/02 ,  G09G3/20 ,  G02F1/1345 ,  H01L23/31 ,  H01L23/482 ,  H01L23/498 ,  H01L23/49 ,  H05K1/18

Abstract: A chip-on-film package includes a base substrate on which a first pad region, a second pad region, and a third region located between the first pad region and the second pad region are defined, a dummy pad disposed on the first pad region, input pads disposed on the first pad region, output pads disposed on the second region, a first detection line disposed on the base substrate, and a second detection line disposed on the base substrate. The first detection line is connected to a first input pad and a second input pad via the second pad region to form a first loop between the first input pad and the second input pad, and the second detection line is connected to the dummy pad and the first detection line via the third region to form a second loop between the dummy pad and the first input pad.

公开(公告)号：US11693451B2

公开(公告)日：2023-07-04

申请号：US17474276

申请日：2021-09-14

Applicant: Samsung Display Co., Ltd.

Inventor： Hirotsugu Kishimoto ,  Dasom Gu ,  Yongchan Jeon ,  Sung-Ki Jung ,  Seungkyun Hong ,  Hyun-Been Hwang

IPC: G06F1/16 ,  H04M1/02

CPC classification number: G06F1/1643 ,  H04M1/0214 ,  H04M1/0266

Abstract: A digitizer includes a folding area a non-folding area. The digitizer includes a first base layer, a second base layer disposed on the first base layer, a third base layer disposed on the second base layer, a first sensing line disposed between the first base layer and the second base layer, and a second sensing line substantially perpendicular to the first sensing line, disposed between the second base layer and the third base layer, and including a first sub-line portion and a second sub-line portion disposed in the non-folding area, and a third sub-line portion disposed between the first sub-line portion and the second sub-line portion and corresponding to the folding area. The third sub-line portion has a fracture strain greater than a fracture strain of the first sub-line portion and the second sub-line portion.

公开(公告)号：US11614777B2

公开(公告)日：2023-03-28

申请号：US17368012

申请日：2021-07-06

Applicant: Samsung Display Co., Ltd.

Inventor： Hirotsugu Kishimoto ,  Jeongil Yoo ,  Yunjae Kim ,  Jaiku Shin ,  Dongho Lee ,  Sung-Ki Jung ,  Chul Ho Jeong ,  Seungkyun Hong

IPC: G06F1/16 ,  H01L51/52 ,  H01L51/00 ,  G06F3/046 ,  G06F3/044 ,  H01L51/56

Abstract: An electronic apparatus includes a display panel having non-folding areas arranged along a first direction, and a folding area disposed between the non-folding areas and folded along an imaginary folding axis extending in a second direction crossing the first direction, a lower protective film disposed below the display panel, a detection sensor disposed below the protective film, and a lower member disposed below the detection sensor. The detection sensor includes a digitizer including first sensing coils and second sensing coils, which are insulated and spaced apart from each other, and a shielding layer disposed below the digitizer. The shielding layer overlaps the folding area and a shielding opening is defined through the shielding layer.