LASER ETCHING APPARATUS AND LASER ETCHING METHOD USING THE SAME

    公开(公告)号:US20230294209A1

    公开(公告)日:2023-09-21

    申请号:US18097122

    申请日:2023-01-13

    CPC classification number: B23K26/362

    Abstract: A laser etching method include performing a first emission process by emitting a laser beam from a laser module toward a substrate fastened to a chuck in a laser etching chamber, moving a protection window between the chuck and the laser module in a first direction by a first distance after the performing the first emission process, performing a second emission process by emitting a laser beam from the laser module after the moving the protection window in the first direction by the first distance, moving the protection window in an opposite direction of the first direction by a second distance after the performing the second emission process, and performing a third emission process by emitting a laser beam from the laser module after the moving the protection window in the opposite direction of the first direction by the second distance.

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