公开(公告)号：US20230294209A1

公开(公告)日：2023-09-21

申请号：US18097122

申请日：2023-01-13

Applicant: Samsung Display Co., Ltd.

Inventor： Heungyeol NA ,  Yoonchul KIM ,  Seong Jin YEON ,  Jungwoo CHOI

IPC: B23K26/362

CPC classification number: B23K26/362

Abstract: A laser etching method include performing a first emission process by emitting a laser beam from a laser module toward a substrate fastened to a chuck in a laser etching chamber, moving a protection window between the chuck and the laser module in a first direction by a first distance after the performing the first emission process, performing a second emission process by emitting a laser beam from the laser module after the moving the protection window in the first direction by the first distance, moving the protection window in an opposite direction of the first direction by a second distance after the performing the second emission process, and performing a third emission process by emitting a laser beam from the laser module after the moving the protection window in the opposite direction of the first direction by the second distance.