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    LASER PROCESSING APPARATUS
    3.
    发明申请
    LASER PROCESSING APPARATUS 有权

    公开(公告)号：US20210325639A1

    公开(公告)日：2021-10-21

    申请号：US17361560

    申请日：2021-06-29

    Applicant: Samsung Display Co., Ltd.

    Inventor： Emil ASLANOV ,  Je Kil RYU ,  Hae Sook LEE ,  Kyung Hoon CHUNG ,  Gyoo Wan HAN

    IPC: G02B13/00 ,  B23K26/06 ,  G02B26/10 ,  B23K26/082

    Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

    LASER CRYSTALLIZATION APPARATUS
    6.
    发明申请
    LASER CRYSTALLIZATION APPARATUS 有权

    公开(公告)号：US20220214531A1

    公开(公告)日：2022-07-07

    申请号：US17509300

    申请日：2021-10-25

    Applicant: Samsung Display Co., LTD.

    Inventor： Akifumi SANGU ,  Je Kil RYU ,  Cheol Ho PARK ,  Hae Sook LEE ,  Jin Hong JEUN ,  Young Su CHAE ,  Gyoo Wan HAN

    IPC: G02B17/00 ,  H01L21/67 ,  B23K26/50

    Abstract: A laser crystallization apparatus according to an embodiment includes: a light source unit which irradiates a laser beam; and a path conversion unit which converts the laser beam incident from the light source unit into a linear beam having a long axis parallel to a first direction and a short axis parallel to a second direction. The linear beam propagates in a third direction perpendicular to the first direction and the second direction, the path conversion unit includes an incident window extending parallel to a first length direction, an emission window extending parallel to a second direction, a first reflection unit disposed at the same side with the incident window, and a second reflection unit disposed at the same side with the emission window, and the second length direction extends parallel to the first direction in a view of the third direction.

    LASER PROCESSING APPARATUS
    7.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开

    公开(公告)号：US20180157006A1

    公开(公告)日：2018-06-07

    申请号：US15793698

    申请日：2017-10-25

    Applicant: Samsung Display Co. Ltd.

    Inventor： Emil ASLANOV ,  Je Kil RYU ,  Hae Sook LEE ,  Kyung Hoon CHUNG ,  Gyoo Wan HAN

    IPC: G02B13/00 ,  G02B26/10 ,  B23K26/06

    Abstract: A laser processing apparatus includes a laser source which generates a laser beam; a scanner unit disposed in an optical path of the laser beam from the laser source and which adjusts the optical path of the laser beam from the laser source in a first direction or in a second direction different from the first direction; and a reflector unit disposed in an optical path of the laser beam adjusted by the scanner unit and which reflects the laser beam adjusted by the scanner unit, where the reflector unit includes a first sub-reflector unit which shifts an optical path of the laser adjusted by the scanner unit in the first direction, and a second sub-reflector unit which shifts an optical path of the laser beam adjusted by the scanner unit in a third direction opposite to the first direction.

    METHOD FOR CUTTING SUBSTRATE
    8.
    发明申请
    METHOD FOR CUTTING SUBSTRATE 有权
    切割基板的方法

    公开(公告)号：US20150108089A1

    公开(公告)日：2015-04-23

    申请号：US14324825

    申请日：2014-07-07

    Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

    Inventor： Il Young JEONG ,  Tae Yong KIM ,  Cheol Lae ROH ,  Je Kil RYU ,  Jeong Hun WOO ,  Gyoo Wan HAN ,  Ki Su HAN ,  Tae Hyoung CHO ,  Jong Nam MOON

    IPC: B44C1/22

    CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

    Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

    Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。

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