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公开(公告)号：US09899724B2
公开(公告)日：2018-02-20
申请号：US15387807
申请日：2016-12-22
Applicant: Samsung Display Co., Ltd.
Inventor： Sangrock Yoon , Sunghwan Kim , Onsik Choi , Ung Choi
CPC classification number: H01Q1/2266 , H01Q1/2283 , H01Q1/2291 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q21/28
Abstract: A display device including a display panel which displays an image, a driving circuit substrate disposed on a rear surface of the display panel and configured to control the display panel to display the image; a protective cover coupled to the display panel while interposing the driving circuit substrate there between to protect the driving circuit substrate; and an antenna pattern attached to the protective cover and configured to transmit and receive a wireless signal.
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公开(公告)号：US09564675B2
公开(公告)日：2017-02-07
申请号：US13958053
申请日：2013-08-02
Applicant: Samsung Display Co., Ltd.
Inventor： Sangrock Yoon , Sunghwan Kim , Onsik Choi , Ung Choi
CPC classification number: H01Q1/2266 , H01Q1/2283 , H01Q1/2291 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q21/28
Abstract: A display device includes a display panel which displays an image, a driving circuit substrate disposed on a rear surface of the display panel and controlling the display panel to display the image, and a chip antenna connected to an end portion of the driving circuit substrate in a longitudinal direction of the driving circuit substrate.
Abstract translation: 显示装置包括显示图像的显示面板，设置在显示面板的后表面上并控制显示面板显示图像的驱动电路基板，以及连接到驱动电路基板的端部的芯片天线 驱动电路基板的纵向方向。
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公开(公告)号：US12212043B2
公开(公告)日：2025-01-28
申请号：US17861517
申请日：2022-07-11
Inventor： Sangrock Yoon , Kiseo Kim , Eunjin Sung , Byeongjin Kim , Jungsuek Oh , Jeongtaek Oh , Seungwook Chun
Abstract: Disclosed is an electronic device that includes a window, a display panel that is disposed under the window and that has a display area and a non-display area defined therein, a lower member that is disposed under the display panel and that includes a lower conductive layer, a transmission line disposed between the display panel and the lower member, a conductive partition wall spaced apart from the transmission line and disposed to overlap the display area, and a housing coupled with the window to define a receiving space in which the display panel, the lower member, and the transmission line are disposed.
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公开(公告)号：US10910338B2
公开(公告)日：2021-02-02
申请号：US16362076
申请日：2019-03-22
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Jeonghun Go , Jeong-Mo Nam , Sangrock Yoon
IPC: H01L23/00 , H01L23/31 , H01L21/56 , H01L23/498
Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.
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公开(公告)号：US10551700B2
公开(公告)日：2020-02-04
申请号：US15855235
申请日：2017-12-27
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Myeong-Eon Lee , Jeong-Mo Nam , Sangrock Yoon
IPC: G02F1/1362 , G02F1/1368 , G02F1/1339 , G02F1/1333 , G02F1/1335
Abstract: A display apparatus includes first and second substrates, a first side sealing layer, a ground connecting part, a flexible film, a driving circuit substrate, and a backlight assembly. The first substrate includes sides extending in a first and a second direction. The second substrate is disposed opposite to the first substrate and is larger in the second direction. The second substrate includes a thin film transistor, a ground wiring and first to fourth side surfaces. The first side sealing layer is disposed on the fourth side surface. The ground connecting part is disposed on the second substrate and is electrically connected to the ground wiring and the first side sealing layer. The flexible film is connected to the second substrate. The driving circuit substrate is connected to the flexible film. The backlight assembly is disposed between the driving circuit substrate and the first substrate.
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Patent Agency Ranking
公开(公告)号：US11862845B2
公开(公告)日：2024-01-02
申请号：US17325841
申请日：2021-05-20
Inventor： Gangil Byun , Sangrock Yoon , Kiseo Kim , Donghyee Hwang
CPC classification number: H01Q1/243 , H01Q1/44 , H01Q5/35 , H01Q9/0407
Abstract: An electronic device includes a display panel including an antenna. The antenna includes a first antenna portion. A second antenna portion is spaced apart from the first antenna portion in a first direction. A plurality of intermediate antenna portions is disposed between the first antenna portion and the second antenna portion and is electrically connected to the first antenna portion and the second antenna portion. The first antenna portion includes a first pattern portion and a first line portion having a first width in a second direction crossing the first direction. The second antenna portion includes a second pattern portion and a second line portion having a second width in the second direction that is larger than the first width.
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公开(公告)号：US11793052B2
公开(公告)日：2023-10-17
申请号：US17647140
申请日：2022-01-05
Inventor： Eunjin Sung , Jungsuek Oh , Kiseo Kim , Byeongjin Kim , Jeongtaek Oh , Sangrock Yoon
CPC classification number: H10K59/40 , G06F3/0412 , G06F3/0446 , G06F3/0448 , H10K50/84
Abstract: A display device includes a display panel, a sensing electrode disposed on the display panel, a transmission line disposed on the display panel and spaced apart from the sensing electrode, an insulating layer disposed on the sensing electrode and the transmission line, and a radiation electrode disposed on the insulating layer. A portion of the transmission line overlaps a portion of the radiation electrode when viewed in a plane.
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公开(公告)号：US20220109227A1
公开(公告)日：2022-04-07
申请号：US17349676
申请日：2021-06-16
Applicant: SAMSUNG DISPLAY CO.. LTD.
Inventor： Seongryong Lee , Kiseo Kim , Jae-Kyoung Kim , Eunjin Sung , Sangrock Yoon
Abstract: An electronic device includes a display module including a display area and a non-display area. An antenna layer is disposed on the display module, including a bending area at least partially overlapping the non-display area and a non-bending area adjacent to the bending area, and including a first portion disposed in the non-bending area and a second portion disposed in the bending area, and bent, and a spacer disposed between the second portion and the display module and including a metal plate that is bent.
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公开(公告)号：US11721885B2
公开(公告)日：2023-08-08
申请号：US17349676
申请日：2021-06-16
Applicant: SAMSUNG DISPLAY CO.. LTD.
Inventor： Seongryong Lee , Kiseo Kim , Jae-Kyoung Kim , Eunjin Sung , Sangrock Yoon
CPC classification number: H01Q1/243 , G06F1/1643 , G06F3/0412 , G06F3/0446
Abstract: An electronic device includes a display module including a display area and a non-display area. An antenna layer is disposed on the display module, including a bending area at least partially overlapping the non-display area and a non-bending area adjacent to the bending area, and including a first portion disposed in the non-bending area and a second portion disposed in the bending area, and bent, and a spacer disposed between the second portion and the display module and including a metal plate that is bent.
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公开(公告)号：US10276538B2
公开(公告)日：2019-04-30
申请号：US15661769
申请日：2017-07-27
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Jeonghun Go , Jeong-Mo Nam , Sangrock Yoon
IPC: H01L21/56 , H01L23/00 , H01L23/31 , H01L23/498
Abstract: A mounting method of an electronic device includes providing an electronic device which includes a semiconductor chip body including an upper surface, a lower surface opposite to the upper surface, and side surfaces connecting the upper surface and the lower surface, a plurality of bumps disposed on the lower surface, and an under-fill element disposed on at least one side surface. The method further includes mounting the electronic device on a printed circuit board including connecting pads formed thereon. The bumps of the semiconductor chip body are connected to the connecting pads. The method additionally includes heating the under-fill element to a predetermined temperature to form an under-fill layer between the lower surface of the semiconductor chip body and the printed circuit board.
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