公开(公告)号：US20130182204A1

公开(公告)日：2013-07-18

申请号：US13788615

申请日：2013-03-07

Applicant: Samsung Display Co., Ltd.

Inventor： Yong-Hwan SHIN ,  Baek-Kyun JEON ,  Kyoung-Tae KIM ,  Bong-Sun SEO ,  Mee-Hye JUNG ,  Young-Gu KIM ,  Min-Sik JUNG ,  Byoung-Hun SUNG ,  Jeong-Hye CHOI ,  Sung-Yi KIM

IPC: G02F1/1337

CPC classification number: G02F1/133707 ,  G02F1/133753 ,  G02F1/133788 ,  G02F2001/133761

Abstract: The present invention discloses an alignment substrate that includes a base substrate and an alignment layer arranged on the base substrate. A plurality of unit pixels is defined in the base substrate. The alignment layer includes at least two sub-alignment portions dividing the unit pixel into at least two domains. Each sub-alignment portion is arranged in a different domain of the at least two domains and is aligned to have a different pretilt direction from the other sub-alignment portions.

Abstract translation: 本发明公开了一种对准基板，其包括基底基板和布置在基底基板上的取向层。 在基底基板中限定多个单位像素。 对准层包括将单位像素分成至少两个域的至少两个子对准部分。 每个子对准部分布置在至少两个畴的不同区域中，并且对齐以具有与其它子对准部分不同的预倾斜方向。

公开(公告)号：US20180043501A1

公开(公告)日：2018-02-15

申请号：US15664166

申请日：2017-07-31

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Jin CHO ,  Joon-Hwa BAE ,  Byoung Kwon CHOO ,  Byung Hoon KANG ,  Jun Hyuk CHEON ,  Jeong-Hye CHOI ,  Young Ho JEONG ,  Woo Jin CHO

IPC: B24B37/34 ,  B24B53/017 ,  B24B37/10

CPC classification number: B24B37/345 ,  B24B37/10 ,  B24B53/017

Abstract: A substrate polishing system includes: a polishing machine and a substrate transporter. The polishing machine includes: a lower surface plate to which a substrate is mounted, and an upper surface plate which faces the lower surface plate and polishes the substrate in cooperation with the lower surface plate, the upper surface plate having a larger area than the substrate mounted on the lower surface plate. The substrate transporter is adjacent to the polishing machine and commonly transports the substrate to and from the polishing machine in a first direction, attaches the substrate to the lower surface plate before polishing thereof, and separates from the lower surface plate the substrate after polishing thereof.