公开(公告)号：US20180121013A1

公开(公告)日：2018-05-03

申请号：US15787092

申请日：2017-10-18

Applicant: Samsung Display Co., Ltd.

Inventor： Jung Mi YUN ,  Ung CHOI ,  Jeong Mo NAM

IPC: G06F3/041 ,  G06F3/044 ,  G02F1/1333

Abstract: A display device includes: a display panel which displays an image with light; a touch sensing unit which senses a touch thereto, provided on the display panel; a control board which provides a control signal to control the display panel and the touch sensing unit, provided outside the display panel and the touch sensing unit, the control board including a first conductive layer and a second conductive layer which is on the first conductive layer; a first coupling member which electrically couples the display panel with the first conductive layer of the control board; and a second coupling member which electrically couples the touch sensing unit with the second conductive layer of the control board.

公开(公告)号：US20170154792A1

公开(公告)日：2017-06-01

申请号：US15164228

申请日：2016-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jeong Hun GO ,  Yeon Sun NA ,  Jeong Mo NAM ,  Hyun Seok HONG

IPC: H01L21/54 ,  H01L23/498 ,  H01L23/18 ,  H01L21/48 ,  H01L21/52

CPC classification number: H01L21/54 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L23/18 ,  H01L23/49811 ,  H01L23/49838

Abstract: A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.