公开(公告)号：US10747074B2

公开(公告)日：2020-08-18

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H05K1/02 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20180329253A1

公开(公告)日：2018-11-15

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/498 ,  H05K1/02 ,  H01L27/12 ,  H05K1/18 ,  H01L23/00

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US11215883B2

公开(公告)日：2022-01-04

申请号：US16924618

申请日：2020-07-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H05K1/02 ,  G02F1/1345 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10031385B2

公开(公告)日：2018-07-24

申请号：US15604877

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US09664964B2

公开(公告)日：2017-05-30

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H01L23/498 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20160062172A1

公开(公告)日：2016-03-03

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract translation: 薄膜封装芯片包括基底基板，输入线，集成电路（IC）芯片和输出线。 输入线设置在基底基板上.IC芯片电连接到输入线。 输出线包括主输出和副输出线。主输出线与IC芯片电连接，并从IC芯片沿第一方向延伸。 副输出线电连接到IC芯片。 子输出线包括至少六个弯曲部分，并且沿第一方向延伸。

公开(公告)号：US09029710B2

公开(公告)日：2015-05-12

申请号：US13706622

申请日：2012-12-06

Applicant: Samsung Display Co., Ltd.

Inventor： Byung-Goo Jung ,  Joo-Yeon Won ,  Chong-Guk Lee ,  Sung-Dong Park

IPC: H05K1/00 ,  H05K7/06 ,  H05K1/03 ,  H01L23/495 ,  G02F1/1345

CPC classification number: H05K7/06 ,  G02F1/13452 ,  H01L23/49572 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/0393 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.

Abstract translation: 一种带式封装，包括基底基板，设置在基底基板上的输入引线，输入引线包括主输入引线和副输入引线，副输入引线从主输入引线 电连接到子输入引线的集成电路芯片，以及将集成电路芯片固定在基底基板上并与主输入引线的一部分重叠的密封部件。

公开(公告)号：US09953600B2

公开(公告)日：2018-04-24

申请号：US15141912

申请日：2016-04-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Se-Hui Jang ,  Chong-Guk Lee ,  Sang-Moon Moh ,  Su-Mi Moon

IPC: G06F3/038 ,  G09G3/36 ,  G02F1/1333

CPC classification number: G09G3/3648 ,  G02F1/1333 ,  G02F1/13452 ,  G09G2300/0426 ,  G09G2300/08

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

公开(公告)号：US20170069253A1

公开(公告)日：2017-03-09

申请号：US15141912

申请日：2016-04-29

Applicant: SAMSUNG DISPLAY CO. LTD.

Inventor： SE-HUI JANG ,  Chong-Guk Lee ,  Sang-Moon Moh ,  Su-Mi Moon

IPC: G09G3/20

CPC classification number: G09G3/3648 ,  G02F1/1333 ,  G02F1/13452 ,  G09G2300/0426 ,  G09G2300/08

Abstract: A display apparatus includes a first substrate and a second substrate. The first substrate includes a switching element and a pixel electrode electrically connected to the switching element. A display panel driver applies a driving signal to the display panel. The display panel driver includes a printed circuit board including a first bonding pad and a flexible substrate electrically connecting the printed circuit board with the display panel. The flexible substrate includes a second bonding pad. The second bonding pad is electrically connected to the first bonding pad of the printed circuit board. The first bonding pad overlaps the second bonding pad. At least a portion of the first bonding pad and at least a portion of the second bonding pad extend in a direction which is at an acute angle with respect to a first direction parallel with a relatively longer side of the display panel.

Abstract translation: 显示装置包括第一基板和第二基板。 第一基板包括与开关元件电连接的开关元件和像素电极。 显示面板驱动器将驱动信号施加到显示面板。 显示面板驱动器包括印刷电路板，其包括将印刷电路板与显示面板电连接的第一接合焊盘和柔性基板。 柔性基板包括第二接合焊盘。 第二接合焊盘电连接到印刷电路板的第一接合焊盘。 第一接合焊盘与第二接合焊盘重叠。 第一接合焊盘的至少一部分和第二接合焊盘的至少一部分相对于与显示面板的相对较长的一侧平行的第一方向成锐角的方向延伸。

公开(公告)号：US20150230337A1

公开(公告)日：2015-08-13

申请号：US14527229

申请日：2014-10-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： DONG-IN KIM ,  Hyun-Seok Hong ,  Sang-Min Jeon ,  Joo-Yeon Won ,  Chong-Guk Lee

IPC: H05K1/11 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/111 ,  H05K1/147 ,  H05K1/181 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/10128 ,  Y10T29/49126

Abstract: A display device includes a display panel including a display area and a non-display area, a plurality of driver integrated circuits mounted on the non-display area of the display panel by a COG method, a printed circuit board (PCB) configured to provide a signal to the plurality of driver integrated circuits, and a flexible printed circuit (FPC) configured to transfer the signal from the PCB to the plurality of driver integrated circuits. The FPC has a first end portion and a second end portion opposite to the first end portion. The first end portion is attached on the non-display area of the display panel by a FOG method, and the second end portion is attached on the PCB. A width of the second end portion is different from a width of the first end portion.

Abstract translation: 显示装置包括显示面板和非显示区域的显示面板，通过COG方法安装在显示面板的非显示区域上的多个驱动器集成电路，印刷电路板（PCB） 向多个驱动器集成电路提供的信号，以及被配置为将信号从PCB传送到多个驱动器集成电路的柔性印刷电路（FPC）。 FPC具有与第一端部相对的第一端部和第二端部。 第一端部通过FOG方法附着在显示面板的非显示区域上，第二端部附着在PCB上。 第二端部的宽度与第一端部的宽度不同。