SPUTTERING APPARATUS AND METHOD THEREOF
    1.
    发明申请
    SPUTTERING APPARATUS AND METHOD THEREOF 审中-公开
    溅射装置及其方法

    公开(公告)号:US20150184285A1

    公开(公告)日:2015-07-02

    申请号:US14558521

    申请日:2014-12-02

    CPC classification number: H01J37/3405 C23C14/228 C23C14/35 H01J37/3447

    Abstract: A sputtering apparatus includes a chamber, a plate disposed inside the chamber, a target unit including at least one targer facing the plate, a power supply unit coupled to the target, and a filter unit disposed between the substrate and the target. The filter unit includes at least one filter. A substrate is disposed on the plate. The filter unit may include a first filter and a second filter with the first filter disposed between the target and the second filter.

    Abstract translation: 溅射装置包括室,设置在室内的板,包括面向板的至少一个更大的目标单元,耦合到靶的电源单元和布置在基板和靶之间的过滤器单元。 过滤器单元包括至少一个过滤器。 基板设置在板上。 过滤器单元可以包括第一过滤器和第二过滤器,其中第一过滤器设置在目标和第二过滤器之间。

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