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公开(公告)号：US20220386476A1
公开(公告)日：2022-12-01
申请号：US17827768
申请日：2022-05-29
Applicant: Samsung Display Co., Ltd.
Inventor： HAYOUNG CHOI , SANG-CHUL BYUN
Abstract: An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.
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公开(公告)号：US20240179977A1
公开(公告)日：2024-05-30
申请号：US18436325
申请日：2024-02-08
Applicant: Samsung Display Co., LTD.
Inventor： HAYOUNG CHOI
IPC: H10K59/131 , H10K59/12 , H10K59/80 , H10K71/00 , H10K77/10 , H10K102/00
CPC classification number: H10K59/131 , H10K59/873 , H10K71/00 , H10K59/1201 , H10K77/111 , H10K2102/311
Abstract: A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.
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公开(公告)号：US20230403907A1
公开(公告)日：2023-12-14
申请号：US18132220
申请日：2023-04-07
Applicant: Samsung Display Co., LTD.
Inventor： EUN-KYUNG YEON , HYUNKYUNG YUN , SANGDUK LEE , HOIKWAN LEE , HAYOUNG CHOI
CPC classification number: H10K59/87 , H10K59/8792 , H10K71/00
Abstract: A method for manufacturing a display device includes: preparing a display panel including a first region, a bending region, and a second region, which are arranged in a first direction; disposing a release film overlapping the bending region on the display panel; applying a resin onto the first region to form a resin coating layer; pressing the resin coating layer, using a stamp coated with a release material; and curing the resin coating layer to form a preliminary resin layer.
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公开(公告)号：US20230115802A1
公开(公告)日：2023-04-13
申请号：US17878315
申请日：2022-08-01
Applicant: Samsung Display Co., Ltd.
Inventor： SANG-CHUL BYUN , HAYOUNG CHOI
Abstract: A display device includes a substrate including a display area and a pad area positioned at one side of the display area, a first pad electrode disposed on the pad area of the substrate, a second pad electrode disposed on the pad area of the substrate to be spaced apart from the first pad electrode, a dam structure disposed between the first pad electrode and the second pad electrode, an adhesive member disposed on the first pad electrode, the second pad electrode and the dam structure, where the adhesive member includes a first conductive ball, a second conductive ball and a, and an electronic component disposed on the adhesive member. The dam structure includes a photo-curable polymer material and is formed by an inkjet process. The adhesive member includes a thermosetting polymer material, and is formed by an inkjet process.
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Patent Agency Ranking
公开(公告)号：US20200051810A1
公开(公告)日：2020-02-13
申请号：US16655724
申请日：2019-10-17
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： DONGBIN UM , JIHONG HWANG , HAYOUNG CHOI
IPC: H01L21/02 , H01L51/00 , G02F1/1333 , G02F1/1337 , H01L27/12 , G02F1/1345
Abstract: A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.
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公开(公告)号：US20240196705A1
公开(公告)日：2024-06-13
申请号：US18524958
申请日：2023-11-30
Applicant: Samsung Display Co., LTD.
Inventor： HYUNKYUNG YUN , EUN-KYUNG YEON , JOOHYEON LEE , HOIKWAN LEE , HAYOUNG CHOI
CPC classification number: H10K59/873 , H10K59/1201 , H10K59/38 , H10K77/111 , H10K2102/311
Abstract: A display device includes a display module and a protection member disposed on the display module. The protection member includes a first protection layer and a second protection layer disposed on the first protection layer. The first protection layer has a storage modulus in a range of about 0.005 MPa to about 0.2 MPa at a room temperature. The second protection layer has a first thickness in a range of about 300 μm to about 1 mm, and has a Young's modulus in a range of about 1 GPa to about 8 GPa at the room temperature.
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公开(公告)号：US20230006021A1
公开(公告)日：2023-01-05
申请号：US17716277
申请日：2022-04-08
Applicant: Samsung Display Co., LTD.
Inventor： HAYOUNG CHOI
Abstract: A display device includes a display panel, a circuit board, a first conductive film, first and second lower films, and first and second adhesive layers. The display panel includes a display area and a pad area which includes a first pad part. The circuit board is attached on the display panel and includes a lead part overlapping the first pad part. The first conductive film is between the display panel and the circuit board and electrically connects the first pad part and the lead part to each other. The first and second lower films are attached to the display panel to respectively correspond to the display area and the pad area. A thickness of the second adhesive layer between the display panel and the second lower film is less than a thickness of the first adhesive layer between the display panel and the first lower film.
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公开(公告)号：US20210157374A1
公开(公告)日：2021-05-27
申请号：US16939866
申请日：2020-07-27
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： HAYOUNG CHOI , Chung-Seok LEE
IPC: G06F1/18
Abstract: A display device includes a display panel, a bonding substrate and a bridge board. The display panel includes a pixel array disposed on a base substrate and an input pad electrically connected to the pixel array. The bonding substrate is disposed under the display panel and includes an output pad. The bridge board is bonded to the input pad of the display panel and the output pad of the bonding substrate to electrically connect the display panel to the bonding substrate, wherein the bridge board includes a rigid material.
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公开(公告)号：US20170323779A1
公开(公告)日：2017-11-09
申请号：US15585357
申请日：2017-05-03
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： DONGBIN UM , JIHONG HWANG , HAYOUNG CHOI
IPC: H01L21/02 , G02F1/1337 , G09G3/36 , H01L27/12
CPC classification number: H01L21/02107 , G02F1/133305 , G02F1/133711 , G02F1/13454 , G02F2201/50 , H01L21/02112 , H01L27/1214 , H01L27/1218 , H01L27/1262 , H01L51/0097
Abstract: A method of manufacturing a display apparatus is provided as follows. A substrate having a display portion on an upper surface of the substrate is prepared. A protection film having an opening is attached to a lower surface of the substrate so that the protection film overlaps the display portion. A support film is attached to the lower surface so that the support film is disposed within the opening of the protection film. A driving circuit chip is attached to the upper surface so that the driving chip is spaced apart from the display portion and the opening. At least a part of the support film is removed. The substrate is bent along a longitudinal direction of the opening.
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