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公开(公告)号：US11796568B2
公开(公告)日：2023-10-24
申请号：US17496154
申请日：2021-10-07
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani
IPC: H05K3/30 , G01R3/00 , G01R31/319 , G01R1/067 , G01R1/073
CPC classification number: G01R3/00 , G01R1/06761 , G01R1/07342 , G01R31/31905 , G01R1/07307 , Y10T29/49002
Abstract: Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe.
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2.发明授权公开(公告)号：US11467229B2
公开(公告)日：2022-10-11
申请号：US16880807
申请日：2020-05-21
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Alessandro Paolo Bramanti , Alberto Pagani
Abstract: Various embodiments provide a triaxial magnetic sensor, formed on or in a substrate of semiconductor material having a surface that includes a sensing portion and at least one first and one second sensing wall, which are not coplanar to each other. The sensing portion and the first sensing wall form a first solid angle, the sensing portion and the second sensing wall form a second solid angle, and the first sensing wall and the second sensing wall form a third solid angle. A first Hall-effect magnetic sensor extends at least partially over the sensing portion, a second Hall-effect magnetic sensor extends at least partially over the first sensing wall, and a third Hall-effect magnetic sensor extends at least partially over the second sensing wall.
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公开(公告)号：US11355624B2
公开(公告)日：2022-06-07
申请号：US16376482
申请日：2019-04-05
Applicant: STMicroelectronics S.r.l.
Inventor： Alessandro Paolo Bramanti , Alberto Pagani
IPC: H01L29/778 , H01L29/417 , G01R31/26
Abstract: Embodiments are directed to electrically confined ballistic devices, circuits, and networks. One such device includes a heterostructure that has a first semiconductor layer, a second semiconductor layer, and a two-dimensional electrode gas (2DEG) layer between the first and second semiconductor layers. The device further includes an input electrode electrically coupled to the 2DEG layer and an output electrode electrically coupled to the 2DEG layer. A first confinement electrode is positioned on the heterostructure. The first confinement electrode, in use, generates first space charge regions which at least partially define a boundary of the ballistic device within the 2DEG layer between the input electrode and the output electrode in response to a first voltage.
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公开(公告)号：US10991654B2
公开(公告)日：2021-04-27
申请号：US15892467
申请日：2018-02-09
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani
IPC: H01L27/06 , H01J17/00 , H01L23/522 , H01L23/66 , G01R31/302 , G01R31/315
Abstract: A pad forms a connection terminal suitable for coupling circuit elements integrated in a chip to circuits outside the chip itself. At least one inductor is provided for use in the reception/transmission of electromagnetic waves or for supplying the chip with power or both. The connection pad and inductor are combined in a structure which reduces overall occupied area. A magnetic containment structure surrounds the structure to contain a magnetic field of the inductor.
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公开(公告)号：US10677816B2
公开(公告)日：2020-06-09
申请号：US15838550
申请日：2017-12-12
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani
Abstract: A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.
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Patent Agency Ranking
公开(公告)号：US10393692B2
公开(公告)日：2019-08-27
申请号：US15928681
申请日：2018-03-22
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Bruno Murari
Abstract: An integrated electronic device, for detecting for detecting changes in an environmental parameter indicative of an environment surrounding the device, includes: a first conductive element and a second conductive element; a measurement circuit including a first measurement terminal and a second measurement terminal respectively coupled to the first conductive element and the second conductive element. The measurement circuit is configured to provide an electrical potential difference between the first conductive element and the second conductive element is configured to determine a change in an impedance of an electromagnetic circuit including the first conductive element and the second conductive element and formed between the first measurement terminal and the second measurement terminal. The device determines that an increase in a presence of water within the environment has occurred in response to a decrease in a real part of the impedance of the electromagnetic circuit.
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7.发明授权公开(公告)号：US10355337B2
公开(公告)日：2019-07-16
申请号：US15202479
申请日：2016-07-05
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Alberto Pagani
IPC: H01Q1/32 , H01Q1/22 , H01L23/48 , H01L25/065 , H01L23/13 , H01L23/66 , H01L25/03 , H01L25/10 , H01L21/56
Abstract: A base carries a first chip and a second chip oriented differently with respect to the base and packaged in a package. Each chip integrates an antenna and a magnetic via. A magnetic coupling path connects the chips, forming a magnetic circuit that enables transfer of signals and power between the chips even if the magnetic path is interrupted, and is formed by a first stretch coupled between the first magnetic-coupling element of the first chip and the first magnetic-coupling element of the second chip, and a second stretch coupled between the second magnetic-coupling element of the first chip and the second magnetic-coupling element of the second chip. The first stretch has a parallel portion extending parallel to the faces of the base. The first and second stretches have respective transverse portions extending on the main surfaces of the second chip, transverse to the parallel portion.
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公开(公告)号：US10330640B2
公开(公告)日：2019-06-25
申请号：US15426747
申请日：2017-02-07
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani
Abstract: A building structure includes a block of building material and a magnetic circuit buried in the block of building material. The structure also includes a plurality of sensing devices buried in the block of building material. Each sensing device may include a contactless power supplying circuit magnetically coupled with the magnetic circuit to generate a supply voltage when the magnetic circuit is subject to a variable magnetic field.
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公开(公告)号：US10280070B2
公开(公告)日：2019-05-07
申请号：US14871322
申请日：2015-09-30
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Alberto Pagani
IPC: H02K3/00 , B81B3/00 , G01C19/5776
Abstract: A magnetic energy harvesting and scavenging circuit includes a first substrate having a first surface and a second surface. An energy harvesting and scavenging coil is formed proximate the first surface. An electromechanical systems device, which may be a MEMS device, includes a moveable mass that extends over the first surface of the first substrate and may be displaced relative to the substrate in three dimensions responsive to an external force applied to the moveable mass. The movable mass includes at least one permanent magnet that is magnetically coupled to the energy harvesting and scavenging coil. Energy harvesting and scavenging circuitry, which may be formed in the first substrate where the first substrate is a semiconductor chip, is electrically coupled to the energy harvesting and scavenging coil and generates electrical energy due to magnetic flux variation through the energy harvesting and scavenging coil responsive to movement of the moveable mass.
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公开(公告)号：US10267849B2
公开(公告)日：2019-04-23
申请号：US15848996
申请日：2017-12-20
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani
Abstract: A sensing structure is presented for use in testing integrated circuits on a substrate. The sensing structure includes a probe region corresponding to a conductive region for connecting to the integrated circuit. A first sensing region at least partially surrounds the probe region. A plurality of sensing elements connects in series such that a first of the plurality of sensing elements has two terminals respectively connected to the first sensing region and the probe region. And a second of the plurality of sensing elements has two terminals respectively connected to the probe region and a first reference potential.
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