公开(公告)号：US20250167100A1

公开(公告)日：2025-05-22

申请号：US18917885

申请日：2024-10-16

Applicant: STMicroelectronics International N.V.

Inventor： Cristiano Gianluca STELLA

IPC: H01L23/52 ,  H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H01L29/16 ,  H01L29/20 ,  H01L29/78

Abstract: Packaged electronic device, having a C-shaped leadframe including a base section and a pair of transverse sections extending transversely to the base section. A first die and a second die have a first contact region at a first main surface and a second contact region at the second main surface; the first main surfaces of the first and the second dice are attached to a first face of the base section of the leadframe. A first lead is coupled to the second contact region of the first die and has a first external contact portion. A second lead is coupled to the second contact region of the second die and has a second external contact portion. A packaging mass surrounds the leadframe, the first lead and the second lead, embeds the first and the second dice and extends level with the base section and with the transverse sections of the leadframe as well as with the external contact portions of the leads.