公开(公告)号：US10177098B2

公开(公告)日：2019-01-08

申请号：US15410230

申请日：2017-01-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US10651101B2

公开(公告)日：2020-05-12

申请号：US15978439

申请日：2018-05-14

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul

IPC: H01L23/055 ,  H01L23/00 ,  H01L33/48 ,  H01L31/0203 ,  H01L23/04 ,  G01S17/02 ,  H01L23/10 ,  G01S7/481 ,  H01L31/16 ,  H01L25/16

Abstract: A support plate has a front face with an electronic chip mounted on the front face. A cover for encapsulating the electronic chip includes a front wall extending in front of the electronic chip and a peripheral wall having an end edge fixed on a peripheral area of the support plate. The support plate and the encapsulating cover define a chamber in which the electronic chip is located. A local slot is arranged to extend between the peripheral wall of the encapsulating cover and the support plate. The local slot has an exterior opening and an interior opening leading into said chamber.

公开(公告)号：US09773740B2

公开(公告)日：2017-09-26

申请号：US14821902

申请日：2015-08-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L27/146 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device, and an electronic device in a stacked configuration, includes a rear face of an integrated-circuit chip that is fixed to a front face of a support wafer. A protective wafer is located facing and at a distance from the front face of the chip, and an infused adhesive is interposed between the chip and the protective wafer and located on a zone of the front face of the chip outside a central region of this front face. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. An obstruction barrier is arranged between the chip and the protective wafer and is disposed outside the central region of the front face of the chip. An encapsulation ring surrounds the chip, the protective wafer and the obstruction barrier.

公开(公告)号：US20170133520A1

公开(公告)日：2017-05-11

申请号：US15410230

申请日：2017-01-19

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/02

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L23/481 ,  H01L24/13 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73257 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US20160163884A1

公开(公告)日：2016-06-09

申请号：US14834923

申请日：2015-08-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul ,  Karine Saxod

IPC: H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L31/186 ,  H01L31/1876 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove (24) recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

Abstract translation: 集成电路芯片安装在基底晶片的顶部，保护晶片安装在集成电路芯片的顶部。 封装块形成在集成电路芯片和保护晶片周围以及基底晶片正面的周边部分周围。 封装块包括布置在集成电路芯片和保护晶片周围的第一封装环，其具有相对于保护晶片的前表面突出的环形凸缘，并且形成相对于该突出的环形珠形凹陷的周边凹槽（24） 。 封装块的第二封装环填充第一封装环的外围沟槽。

公开(公告)号：US11244910B2

公开(公告)日：2022-02-08

申请号：US16862002

申请日：2020-04-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/48

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US10672721B2

公开(公告)日：2020-06-02

申请号：US16208038

申请日：2018-12-03

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203

Abstract: A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

公开(公告)号：US09472692B2

公开(公告)日：2016-10-18

申请号：US14834923

申请日：2015-08-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Marika Sorrieul ,  Karine Saxod

IPC: H01L27/00 ,  H01L31/0203 ,  H01L27/146 ,  H01L31/18 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L31/0203 ,  H01L23/3121 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L31/186 ,  H01L31/1876 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove (24) recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

Abstract translation: 集成电路芯片安装在基底晶片的顶部，保护晶片安装在集成电路芯片的顶部。 封装块形成在集成电路芯片和保护晶片周围以及基底晶片正面的周边部分周围。 封装块包括布置在集成电路芯片和保护晶片周围的第一封装环，其具有相对于保护晶片的前表面突出的环形凸缘，并且形成相对于该突出的环形珠形凹陷的周边凹槽（24） 。 封装块的第二封装环填充第一封装环的外围沟槽。

公开(公告)号：US20160148879A1

公开(公告)日：2016-05-26

申请号：US14821902

申请日：2015-08-10

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Marika Sorrieul

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3171 ,  H01L24/17 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/1876 ,  H01L2224/1329 ,  H01L2224/13291 ,  H01L2224/14179 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/30135 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device, and an electronic device in a stacked configuration, includes a rear face of an integrated-circuit chip that is fixed to a front face of a support wafer. A protective wafer is located facing and at a distance from the front face of the chip, and an infused adhesive is interposed between the chip and the protective wafer and located on a zone of the front face of the chip outside a central region of this front face. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. An obstruction barrier is arranged between the chip and the protective wafer and is disposed outside the central region of the front face of the chip. An encapsulation ring surrounds the chip, the protective wafer and the obstruction barrier.

Abstract translation: 一种电子器件的制造方法和层叠结构的电子器件，其特征在于，包括固定在支撑晶片前面的集成电路芯片的背面。 保护晶片位于与芯片前表面相对并且距离芯片的前面一定距离处，并且输入的粘合剂被插入在芯片和保护晶片之间，并且位于该芯片的正面的中心区域外的区域 面对。 输注的粘合剂包括注入可固化粘合剂中的可固化粘合剂和固体间隔元件。 在芯片和保护晶片之间设置障碍屏障，并且设置在芯片前表面的中心区域的外侧。 封装环围绕芯片，保护晶片和阻塞屏障。