公开(公告)号：US20240379480A1

公开(公告)日：2024-11-14

申请号：US18315964

申请日：2023-05-11

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongMoo Shin ,  SeongKuk Kim ,  SinJae Kim ,  SeokBeom Heo

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/552

Abstract: A semiconductor device has a substrate. An electrical component is disposed over a first surface of the substrate. A solder paste is disposed over the first surface of the substrate. A conductive pillar is disposed on the solder paste. An encapsulant is deposited over the first surface of the substrate, the electrical component, and the conductive pillar. A solder bump is formed over the conductive pillar.

公开(公告)号：US20240258246A1

公开(公告)日：2024-08-01

申请号：US18635819

申请日：2024-04-15

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongKook Shin ,  KyoWang Koo ,  HeeYoun Kim ,  SeongKuk Kim

IPC: H01L23/552 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/3121

Abstract: A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.

公开(公告)号：US11990421B2

公开(公告)日：2024-05-21

申请号：US17648365

申请日：2022-01-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongKook Shin ,  KyoWang Koo ,  HeeYoun Kim ,  SeongKuk Kim

IPC: H01L21/52 ,  H01L21/48 ,  H01L21/50 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/50 ,  H01L23/3121

Abstract: A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.

公开(公告)号：US20230230934A1

公开(公告)日：2023-07-20

申请号：US17648365

申请日：2022-01-19

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： YongKook Shin ,  KyoWang Koo ,  HeeYoun Kim ,  SeongKuk Kim

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/50 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L21/50 ,  H01L21/4871

Abstract: A semiconductor device has a substrate and first and second electrical component disposed over the substrate. A first metal bar is disposed over the substrate between the first electrical component and second electrical component. The first metal bar is formed by disposing a mask over a carrier. An opening is formed in the mask and a metal layer is sputtered over the mask. The mask is removed to leave the metal layer within the opening as the first metal bar. The first metal bar can be stored in a tape-and-reel.