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公开(公告)号：US09459309B2
公开(公告)日：2016-10-04
申请号：US13945819
申请日：2013-07-18
Inventor： Jun-So Pak , Jun-Ho Lee , Joung-Ho Kim
IPC: G01R31/26 , G01R31/319 , G01R31/28
CPC classification number: G01R31/2601 , G01R31/2853 , G01R31/31926
Abstract: A test device for testing a semiconductor device including a TSV may comprise a ring oscillator including a plurality of inverters, a switch selectively connecting an output node of an inverter of the plurality of inverters and the TSV, and a controller controlling the switch.
Abstract translation: 用于测试包括TSV的半导体器件的测试装置可以包括环形振荡器，其包括多个反相器，选择性地连接多个反相器的反相器的输出节点和TSV的开关以及控制开关的控制器。
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Patent Agency Ranking
公开(公告)号：US20140049284A1
公开(公告)日：2014-02-20
申请号：US13945819
申请日：2013-07-18
Inventor： Jun-So Pak , Jun-Ho Lee , Joung-Ho Kim
IPC: G01R31/26
CPC classification number: G01R31/2601 , G01R31/2853 , G01R31/31926
Abstract: A test device for testing a semiconductor device including a TSV may comprise a ring oscillator including a plurality of inverters, a switch selectively connecting an output node of an inverter of the plurality of inverters and the TSV, and a controller controlling the switch.
Abstract translation: 用于测试包括TSV的半导体器件的测试装置可以包括环形振荡器，其包括多个反相器，选择性地连接多个反相器的反相器的输出节点和TSV的开关以及控制开关的控制器。
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公开(公告)号：US20180056794A1
公开(公告)日：2018-03-01
申请号：US15429747
申请日：2017-02-10
Inventor： Joung-Ho Kim , Chi-Uk Song
CPC classification number: B60L11/182 , B60L2200/10 , B60L2210/30 , B64C39/024 , B64C2201/042
Abstract: Disclosed are a three-phase wireless power transfer (WPT) system and three-phase wireless rechargeable unmanned aerial vehicle (UAV) system based on the same. Three power receiving coils, including resonators, are installed at the ends of three landing leg of the UAV. A three-phase power converter installed in the UAV receives the three-phase AC induction current induced in three power receiving coils, including resonators, converting the three-phase AC induction current into a DC current to be charged in a battery. A three-phase power wireless charging apparatus wirelessly transfers three-phase power from three power transmitting coils to the three power receiving coils of the UAV when the three landing legs land on three coil seating units provided on a charging platform. A magnetic flux leakage shielding coil may be provided to prevent magnetic flux leakage from approaching the UAV. The power transfer efficiency is excellent, and electromagnetic interference can be also reduced.
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公开(公告)号：US10081263B2
公开(公告)日：2018-09-25
申请号：US15429747
申请日：2017-02-10
Inventor： Joung-Ho Kim , Chi-Uk Song
CPC classification number: B60L11/182 , B60L53/12 , B60L2200/10 , B60L2210/30 , B64C39/024 , B64C2201/042 , Y02T10/7005 , Y02T10/7072 , Y02T10/7241 , Y02T90/122 , Y02T90/127 , Y02T90/14
Abstract: Disclosed are a three-phase wireless power transfer (WPT) system and three-phase wireless rechargeable unmanned aerial vehicle (UAV) system based on the same. Three power receiving coils, including resonators, are installed at the ends of three landing leg of the UAV. A three-phase power converter installed in the UAV receives the three-phase AC induction current induced in three power receiving coils, including resonators, converting the three-phase AC induction current into a DC current to be charged in a battery. A three-phase power wireless charging apparatus wirelessly transfers three-phase power from three power transmitting coils to the three power receiving coils of the UAV when the three landing legs land on three coil seating units provided on a charging platform. A magnetic flux leakage shielding coil may be provided to prevent magnetic flux leakage from approaching the UAV. The power transfer efficiency is excellent, and electromagnetic interference can be also reduced.
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公开(公告)号：US11990389B2
公开(公告)日：2024-05-21
申请号：US17550347
申请日：2021-12-14
Inventor： Keeyoung Son , Joung-Ho Kim , Subin Kim , Shinyoung Park , Seungtaek Jeong , Gapyeol Park , Boogyo Sim , Hyunwook Park , Taein Shin , Seongguk Kim , Kyungjune Son , Minsu Kim
IPC: H01L23/473 , H01L23/373 , H01L23/48 , H01L23/498 , H01L25/065 , H01L25/18
CPC classification number: H01L23/473 , H01L23/3736 , H01L23/481 , H01L23/49822 , H01L25/0657 , H01L25/18 , H01L2225/06513 , H01L2225/06517
Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.
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公开(公告)号：US20230028887A1
公开(公告)日：2023-01-26
申请号：US17550347
申请日：2021-12-14
Inventor： Keeyoung Son , Joung-Ho Kim , Subin Kim , Shinyoung Park , Seungtaek Jeong , Gapyeol Park , Boogyo Sim , Hyunwook Park , Taein Shin , Seongguk Kim , Kyungjune Son , Minsu Kim
IPC: H01L23/473 , H01L23/498 , H01L25/065 , H01L23/48 , H01L23/373
Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.
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