公开(公告)号：US11990389B2

公开(公告)日：2024-05-21

申请号：US17550347

申请日：2021-12-14

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Keeyoung Son ,  Joung-Ho Kim ,  Subin Kim ,  Shinyoung Park ,  Seungtaek Jeong ,  Gapyeol Park ,  Boogyo Sim ,  Hyunwook Park ,  Taein Shin ,  Seongguk Kim ,  Kyungjune Son ,  Minsu Kim

IPC: H01L23/473 ,  H01L23/373 ,  H01L23/48 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/473 ,  H01L23/3736 ,  H01L23/481 ,  H01L23/49822 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06513 ,  H01L2225/06517

Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

公开(公告)号：US20230028887A1

公开(公告)日：2023-01-26

申请号：US17550347

申请日：2021-12-14

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Keeyoung Son ,  Joung-Ho Kim ,  Subin Kim ,  Shinyoung Park ,  Seungtaek Jeong ,  Gapyeol Park ,  Boogyo Sim ,  Hyunwook Park ,  Taein Shin ,  Seongguk Kim ,  Kyungjune Son ,  Minsu Kim

IPC: H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H01L23/48 ,  H01L23/373

Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.